RC0100JR-071ML Yageo, RC0100JR-071ML Datasheet - Page 5

• Manufacturer Part Number: RC0100JR-071ML
• Description: RES 1M OHM 1/32W 5% 01005 SMD
• Manufacturer: Yageo
• Series: RC01005r

Specifications of RC0100JR-071ML

• Resistance (ohms): 1M
• Power (watts): 0.03W, 1/32W
• Composition: Thick Film
• Temperature Coefficient: ±250ppm/°C
• Tolerance: ±5%
• Size / Dimension: 0.016" L x 0.008" W (0.40mm x 0.20mm)
• Height: 0.005" (0.13mm)
• Lead Style: Surface Mount (SMD - SMT)
• Package / Case: 01005 (0402 Metric)
• Resistance In Ohms: 1.00M
• Case: 01005 (0402 metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Other names: 311-1.0MDHTR

TESTS AND REQUIREMENTS
TEST
Life/Endurance
High
Temperature
Exposure
Moisture
Resistance
Thermal
Shock
Short Time
Overload
Board Flex/
Bending
Solderability
-Leaching
-Resistance
to Soldering
Heat
- Wetting
Chip Resistor Surface Mount
TEST METHOD
IEC 60115-1 4.25.1
IEC 60068-2-2
MIL-STD-202 Method
106G
MIL-STD-202G
Method 107G
IEC 60115-1 4.13
IEC 60068-2-21
IPC/JEDEC
J-STD-002B test B
IPC/JEDEC
J-STD-002B test D
IEC 60068-2-58
PROCEDURE
At 70±5℃ for 1,000 hours; RCWV applied
for 1.5 hours on and 0.5 hour off, still air
required
1,000 hours at 125±5 °C,unpowered
Each temperature / humidity cycle is defined
at 8 hours (method 106F), 3 cycles / 24
hours for 10d with 25 °C / 65 °C 95% R.H,
without steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
-55/+125℃
Note Number of cycles required is 300
Devices unmounted
Maximum transfer time is 20 seconds Dwell
time is 15 minutes. Air - Air
2.5 times RCWV or maximum overload
voltage which is less for 5 seconds at room
temperature
Device mounted or as described only 1
board bending required
2 mm bending time: 60±5 seconds
Electrical Test not required Magnification
50X
SMD conditions:
1st step: method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Solder bath at 260±5℃
Dipping time : 30±1 seconds
Condition B, no pre-heat of samples
Leadfree solder, 260 °C ±5℃, 10 ±1
seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
RC
SERIES
01005(RoHS Compliant & Halogen Free)
REQUIREMENT
±(3%+0.05Ω)
<100mΩ for Jumper
±(1%+0.05Ω)
<50mΩ for Jumper
±(2%+0.05Ω)
<100mΩ for Jumper
±(1%+0.05Ω)
<50mΩ for Jumper
±(2%+0.05Ω)
<50mΩ for Jumper
No visible damage
±(1%+0.05Ω)
<50mΩ for Jumper
No visible damage
Well tinned (>95%
covered)
No visible damage
No visible damage
±(1%+0.05Ω)
<50mΩ for Jumper
No visible damage
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