FDMS2506SDC Fairchild Semiconductor, FDMS2506SDC Datasheet - Page 3
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FDMS2506SDC
Manufacturer Part Number
FDMS2506SDC
Description
MOSFET N-CH 25V DUAL POWER56
Manufacturer
Fairchild Semiconductor
Series
Dual Cool™, PowerTrench®, SyncFET™r
Datasheet
1.FDMS2506SDC.pdf
(9 pages)
Specifications of FDMS2506SDC
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
1.45 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
25V
Current - Continuous Drain (id) @ 25° C
39A
Vgs(th) (max) @ Id
3V @ 1mA
Gate Charge (qg) @ Vgs
93nC @ 10V
Input Capacitance (ciss) @ Vds
5945pF @ 13V
Power - Max
3.3W
Mounting Type
Surface Mount
Package / Case
*
Configuration
Dual
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
1.45 mOhms
Forward Transconductance Gfs (max / Min)
171 S
Drain-source Breakdown Voltage
25 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
49 A
Power Dissipation
89 W
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Gate Charge Qg
30 nC
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
FDMS2506SDCTR
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
FDMS2506SDC
Manufacturer:
FAIRCHILD/仙童
Quantity:
20 000
©2010 Fairchild Semiconductor Corporation
FDMS2506SDC Rev.C
NOTES:
1. R
2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%.
3. E
4. As an N-ch device, the negative Vgs rating is for low duty cycle pulse ocurrence only. No continuous rating is implied.
5. I
Thermal Characteristics
R
R
R
R
R
R
R
R
R
R
R
R
R
R
by the user's board design.
θJC
θJC
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
θJA
SD
AS
θJA
c. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
d. Still air, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
e. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
f. Still air, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
g. 200FPM Airflow, No Heat Sink,1 in
h. 200FPM Airflow, No Heat Sink, minimum pad of 2 oz copper
i. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, 1 in
j. 200FPM Airflow, 20.9x10.4x12.7mm Aluminum Heat Sink, minimum pad of 2 oz copper
k. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, 1 in
l. 200FPM Airflow, 45.2x41.4x11.7mm Aavid Thermalloy Part # 10-L41B-11 Heat Sink, minimum pad of 2 oz copper
≤ 30 A, di/dt ≤ 200 A/μs, V
of 220 mJ is based on starting T
is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. R
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Ambient
DD
≤ BV
J
DSS
= 25
2
, Starting T
pad of 2 oz copper
°
C, L = 1 mH, I
a. 38 °C/W when mounted on
a 1 in
J
2
= 25
pad of 2 oz copper
AS
2
o
C.
pad of 2 oz copper
= 21 A, V
2
pad of 2 oz copper
DD
= 23 V, V
GS
3
2
= 10 V. 100% test at L = 0.3 mH, I
pad of 2 oz copper
2
pad of 2 oz copper
(Bottom Drain)
(Top Source)
(Note 1a)
(Note 1b)
(Note 1c)
(Note 1d)
(Note 1e)
(Note 1g)
(Note 1h)
(Note 1k)
(Note 1f)
(Note 1i)
(Note 1j)
(Note 1l)
θJC
AS
is guaranteed by design while R
= 32 A.
b. 81 °C/W when mounted on
a minimum pad of 2 oz copper
2.7
1.4
38
81
27
34
16
19
26
61
16
23
13
11
θCA
www.fairchildsemi.com
is determined
°C/W