SP3243EET-L Exar Corporation, SP3243EET-L Datasheet - Page 16

• Manufacturer Part Number: SP3243EET-L
• Description: IC TXRX RS232 INTELLIGNT 28WSOIC
• Manufacturer: Exar Corporation
• Type: Transceiverr

Specifications of SP3243EET-L

• Package / Case: 28-SOIC (0.300", 7.50mm Width)
• Number Of Drivers/receivers: 3/5
• Protocol: RS232
• Voltage - Supply: 3 V ~ 5.5 V
• Mounting Type: Surface Mount
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Function: Transceiver
• Mounting Style: SMD/SMT
• Supply Current: 1 uA
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 3 V
• Logic Type: RS-232 Transceivers
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 1016-1122-5

ESD TOLERANCE
The SP3243E series incorporates ruggedized
ESD cells on all driver output and receiver input
pins. The ESD structure is improved over our
previous family for more rugged applications
and environments sensitive to electro-static dis-
charges and associated transients. The improved
ESD tolerance is at least +15kV without damage
nor latch-up.
There are different methods of ESD testing ap-
plied:
The Human Body Model has been the generally
accepted ESD testing method for semi-con-
ductors.
MIL-STD-883, Method 3015.7 for ESD testing.
The premise of this ESD test is to simulate the
human body’s potential to store electro-static
energy and discharge it to an integrated circuit.
The simulation is performed by using a test
model as shown in Figure 23.
will test the IC’s capability to withstand an ESD
transient during normal handling such as in
manufacturing areas where the ICs tend to be
handled frequently.
The IEC-1000-4-2, formerly IEC801-2, is generally
used for testing ESD on equipment and systems.
For system manufacturers, they must guarantee a
certain amount of ESD protection since the system
itself is exposed to the outside environment and
human presence. The premise with IEC1000-4-
2 is that the system is required to withstand an
amount of static electricity when ESD is applied
to points and surfaces of the equipment that are
accessible to personnel during normal usage.
The transceiver IC receives most of the ESD
Figure 23. ESD Test Circuit for Human Body Model
a) MIL-STD-883, Method 3015.7
b) IEC1000-4-2 Air-Discharge
c) IEC1000-4-2 Direct Contact
This method is also specified in
Exar Corporation 48720 Kato Road, Fremont CA, 94538 • 510-668-7017 • www.exar.com
DC Power
Source
R
C
This method
SW1
16
C
S
current when the ESD source is applied to the
connector pins. The test circuit for IEC1000-4-2
is shown on Figure 24. There are two methods
within IEC1000-4-2, the Air Discharge method
and the Contact Discharge method.
With the Air Discharge Method, an ESD voltage
is applied to the equipment under test (EUT)
through air. This simulates an electrically charged
person ready to connect a cable onto the rear of
the system only to find an unpleasant zap just
before the person touches the back panel. The
high energy potential on the person discharges
through an arcing path to the rear panel of the
system before he or she even touches the sys-
tem. This energy, whether discharged directly
or through air, is predominantly a function of
the discharge current rather than the discharge
voltage. Variables with an air discharge such as
approach speed of the object carrying the ESD
potential to the system and humidity will tend to
change the discharge current. For example, the
rise time of the discharge current varies with the
approach speed.
The Contact Discharge Method applies the ESD
current directly to the EUT. This method was
devised to reduce the unpredictability of the ESD
arc. The discharge current rise time is constant
since the energy is directly transferred without the
air-gap arc. In situations such as hand held sys-
tems, the ESD charge can be directly discharged
to the equipment from a person already holding
the equipment. The current is transferred on to
the keypad or the serial port of the equipment
directly and then travels through the PCB and
finally to the IC.
R
S
SW2
Device
Under
Test
SP3243E_101_111009