BGA6489,135 NXP Semiconductors, BGA6489,135 Datasheet
BGA6489,135
Specifications of BGA6489,135
934057502135
BGA6489
Related parts for BGA6489,135
BGA6489,135 Summary of contents
Page 1
BGA6489 MMIC wideband medium power amplifier Rev. 02 — 15 June 2009 1. Product profile 1.1 General description The BGA6489 is a silicon Monolithic Microwave Integrated Circuit (MMIC) wideband medium power amplifier with internal matching circuit in a 3-pin SOT89 ...
Page 2
... NXP Semiconductors 1.4 Quick reference data Table 1. Symbol L1dB 2. Pinning information Table 2. Pin Ordering information Table 3. Type number BGA6489 4. Marking Table 4. Type number BGA6489 BGA6489_2 Product data sheet Quick reference data Parameter Conditions DC device voltage on pin supply current V T insertion power gain f = 1950 MHz noise fi ...
Page 3
... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol tot T stg [ Thermal characteristics Table 6. Symbol R th(j-sp) [ Characteristics Table Symbol Parameter [ operating supply voltage applied Table Symbol Parameter LIN R LOUT BGA6489_2 Product data sheet Limiting values ...
Page 4
... NXP Semiconductors Table unless otherwise specified; see L S Symbol Parameter L1dB IP3 (in) IP3 (out) Fig 1. BGA6489_2 Product data sheet Characteristics …continued = 78 mA IP3 tone spacing = 1 MHz amb (out) noise figure stability factor load power gain compression input intercept point output intercept point 135 0 ...
Page 5
... NXP Semiconductors Fig (dB 500 1000 1500 mA dBm Fig 3. Insertion power gain ( s frequency; typical values BGA6489_2 Product data sheet 135 0.5 0.2 2.6 GHz 0 0.2 0.5 180 0.2 0.5 135 mA dBm Output reflection coefficient (s 22 mgx403 |s 12 (dB) 2000 2500 f (MHz function of Fig 4 ...
Page 6
... NXP Semiconductors 25 P L1dB (dBm 500 1000 1500 mA Fig 5. Load power as a function of frequency; typical values 500 1000 1500 mA Fig 7. Stability factor as a function of frequency; typical values BGA6489_2 Product data sheet mgx404 40 IP3 (out) (dBm 2000 2500 0 f (MHz Fig 6. Output intercept as a function of frequency; ...
Page 7
... NXP Semiconductors Fig 9. Supply current as function of operating junction temperature; typical values 8. Application information Figure 10 internally matched to 50 value of the input and output DC blocking capacitors C1 and C2 depends on the operating frequency; see fine tune the input and output impedance. Capacitor supply decoupling capacitor. ...
Page 8
... NXP Semiconductors Table 9. List of components See Figure 10 for circuit. Component Description C1, C2 multilayer ceramic chip capacitor C3 multilayer ceramic chip capacitor C4 multilayer ceramic chip capacitor [1] C5 electrolytic or tantalum capacitor L1 SMD inductor R1 SMD resistor 0 [1] Optional. 8.1 Scattering parameters Table 10. Scattering parameters mA dBm; Z ...
Page 9
... NXP Semiconductors Table 10. Scattering parameters mA dBm (MHz Magnitude Angle (ratio) (degree) 2700 0.13 143.80 2800 0.12 154.47 2900 0.11 164.40 3000 0.11 178.65 3100 0.12 160.01 BGA6489_2 Product data sheet = amb Magnitude Angle Magnitude (ratio) (degree) (ratio) 5.18 33.88 0.08 5.08 30 ...
Page 10
... NXP Semiconductors 9. Package outline Plastic surface-mounted package; collector pad for good heat transfer; 3 leads DIMENSIONS (mm are the original dimensions) UNIT 1.6 0.48 0.53 1.8 mm 1.4 0.35 0.40 1.4 OUTLINE VERSION IEC SOT89 Fig 11. Package outline SOT89 (SC-62) BGA6489_2 Product data sheet ...
Page 11
... Document ID Release date BGA6489_2 20090615 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Changed I • Table • ...
Page 12
... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
Page 13
... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Application information 8.1 Scattering parameters . . . . . . . . . . . . . . . . . . . 8 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10 10 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 Revision history ...