MMG3009NT1 Freescale Semiconductor, MMG3009NT1 Datasheet - Page 10

• Manufacturer Part Number: MMG3009NT1
• Description: IC AMP RF GP 6000MHZ 5V SOT-89
• Manufacturer: Freescale Semiconductor
• Type: General Purpose Amplifierr

Specifications of MMG3009NT1

• Current - Supply: 70mA
• Frequency: 0Hz ~ 6GHz
• Gain: 15dB
• Noise Figure: 4.2dB
• P1db: 18dBm
• Package / Case: SC-62, SOT-89, TO-243 (3 Leads + Tab)
• Rf Type: Cellular, PCS, PHS, WLL
• Test Frequency: 900MHz
• Voltage - Supply: 5V
• Number Of Channels: 1
• Operating Frequency: 6000 MHz
• Operating Supply Voltage: 5 V
• Supply Current: 82 mA @ 5 V
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Technology: Linear Amplifier
• Rf Transistor Case: SOT-89
• Filter Terminals: SMD
• Peak Reflow Compatible (260 C): Yes
• Leaded Process Compatible: Yes
• Output Third Order Intercept Point, Ip3: 34dB
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: MMG3009NT1; MMG3009NT1TR

MMG3009NT1
10
0.86
1.27
Recommended Solder Stencil
0.64
3.86
1.7
3.48
0.58
Figure 20. Recommended Mounting Configuration
5.33
1.27
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
USED IN PCB LAYOUT DESIGN.
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
PITCH.
7.62
Freescale Semiconductor
2.49
2.54
0.305 diameter
RF Device Data