RMPA5255 Fairchild Semiconductor, RMPA5255 Datasheet - Page 6

• Manufacturer Part Number: RMPA5255
• Description: IC PWR AMP MOD 4.9-5.9GHZ 10-LCC
• Manufacturer: Fairchild Semiconductor
• Type: Power Amplifierr

Specifications of RMPA5255

• Current - Supply: 230mA
• Frequency: 4.9GHz ~ 5.9GHz
• Gain: 34dB
• P1db: 26dBm
• Package / Case: 11-LCC
• Rf Type: WLL, WLAN
• Voltage - Supply: 3V ~ 3.6V
• Number Of Channels: 1
• Frequency (max): 5.9GHz
• Output Power: 26dBm
• Power Supply Requirement: Single
• Single Supply Voltage (min): 3V
• Single Supply Voltage (typ): 3.3V
• Single Supply Voltage (max): 3.6V
• Package Type: PLCC
• Dual Supply Voltage (min): Not RequiredV
• Dual Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (max): Not RequiredV
• Supply Current: 230mA
• Pin Count: 10
• Mounting: Surface Mount
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• Test Frequency: -
• Lead Free Status / Rohs Status: Compliant
• Other names: RMPA5255TR

RMPA5255 Rev. E
Recommended Solder Reflow Profile
Applications Information
CAUTION: THIS IS AN ESD SENSITIVE DEVICE.
Precautions to Avoid Permanent Device Damage:
• Cleanliness: Observe proper handling procedures to ensure
• Device Cleaning: Standard board cleaning techniques should
• Static Sensitivity: Follow ESD precautions to protect against
• General Handling: Handle the package on the top with a
• Device Storage: Devices are supplied in heat-sealed,
Device Usage:
Fairchild recommends the following procedures prior to
assembly.
• Assemble the devices within 7 days of removal from the dry
• During the 7-day period, the devices must be stored in an
• If the 7-day period or the environmental conditions have been
clean devices and PCBs. Devices should remain in their
original packaging until component placement to ensure no
contamination or damage to RF, DC and ground contact
areas.
not present device problems provided that the boards are
properly dried to remove solvents or water residues.
ESD damage:
– A properly grounded static-dissipative surface on which to
– Static-dissipative floor or mat.
– A properly grounded conductive wrist strap for each person
vacuum collet or along the edges with a sharp pair of bent
tweezers. Avoiding damaging the RF, DC, and ground
contacts on the package bottom. Do not apply excessive
pressure to the top of the lid.
moisture-barrier bags. In this condition, devices are protected
and require no special storage conditions. Once the sealed
bag has been opened, devices should be stored in a dry
nitrogen environment.
pack.
environment of less than 60% relative humidity and a
maximum temperature of 30°C
exceeded, then the dry-bake procedure, at 125°C for 24 hours
minimum, must be performed.
place devices.
to wear while handling devices.
100
260
217
200
150
50
25
Ramp-Up R ate
3 °C/sec max
Time 25 °C/sec t o peak tem p
6 mi nutes max
Preheat, 150 to 200 °C
60 - 180 sec
Ramp-Up R ate
3 °C/sec max
6
Time (Sec)
Solder Materials & Temperature Profile:
Reflow soldering is the preferred method of SMT attachment.
Hand soldering is not recommended.
Reflow Profile
• Ramp-up: During this stage the solvents are evaporated from
• Pre-heat/soak: The soak temperature stage serves two
• Reflow Zone: If the temperature is too high, then devices may
• Cooling Zone: Steep thermal gradients may give rise to
Solder Joint Characteristics:
Proper operation of this device depends on a reliable void-free
attachment of the heat sink to the PWB. The solder joint should
be 95% void-free and be a consistent thickness.
Rework Considerations:
Rework of a device attached to a board is limited to reflow of the
solder with a heat gun. The device should be subjected to no
more than 15°C above the solder melting temperature for no
more than 5 seconds. No more than 2 rework operations should
be performed.
the solder paste. Care should be taken to prevent rapid
oxidation (or paste slump) and solder bursts caused by violent
solvent out-gassing. A maximum heating rate is 3°C/sec.
purposes; the flux is activated and the board and devices
achieve a uniform temperature. The recommended soak
condition is: 60-180 seconds at 150-200°C.
be damaged by mechanical stress due to thermal mismatch or
there may be problems due to excessive solder oxidation.
Excessive time at temperature can enhance the formation of
inter-metallic compounds at the lead/board interface and may
lead to early mechanical failure of the joint. Reflow must occur
prior to the flux being completely driven off. The duration of
peak reflow temperature should not exceed 20 seconds.
Soldering temperatures should be in the range 255–260°C,
with a maximum limit of 260°C.
excessive thermal shock. However, rapid cooling promotes a
finer grain structure and a more crack-resistant solder joint.
The illustration below indicates the recommended soldering
profile.
Ramp-Do wn Rate
6 °C/sec max
260 +0/-5 °C
Peak tem p
10 - 20 sec
li quidus temp
60 - 150 sec
Time above
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