SX1230I066TRT Semtech, SX1230I066TRT Datasheet - Page 34

• Manufacturer Part Number: SX1230I066TRT
• Description: IC TX UHF 433/868/916 MHZ 24-QFN
• Manufacturer: Semtech

Specifications of SX1230I066TRT

• Frequency: 315MHz, 434MHz, 868MHz, 915MHz
• Applications: RKE
• Modulation Or Protocol: ISM
• Data Rate - Maximum: 600kbps
• Power - Output: 17dBm
• Current - Transmitting: 95mA
• Data Interface: PCB, Surface Mount
• Antenna Connector: PCB, Surface Mount
• Voltage - Supply: 1.8 V ~ 3.7 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 24-MLPQ
• Operating Temperature (min): -40C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Industrial
• Product Depth (mm): 4mm
• Product Length (mm): 4mm
• Operating Supply Voltage (min): 1.8V
• Operating Supply Voltage (typ): 2.5/3.3V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -
• Memory Size: -
• Lead Free Status / Rohs Status: Supplier Unconfirmed
• Other names: Q4629601; SX1230I066TR; SX1230I066TRT

7.8. TCXO Connection
The frequency accuracy of the SX1230 is dependent upon the precision of the frequency reference from which the RF
output is derived. For applications where high frequency accuracy or stability is required, such as narrow band or licensed
band applications, the connection of a temperature compensated crystal oscillator (TCXO) is possible. The SX1230 allows
the direct connection of a 1.8 V, clipped sine type TCXO to the XTA input. The connection is shown in Figure 21, please
consult your TCXO supplier for an appropriate value of decoupling capacitor, C
7.9. PCB Layout Considerations
Thanks to its fully integrated architecture PCB layout with the SX1230 can be straight forward. It is nonetheless a high
performance RFIC therefore, to attain the best RF performance, certain design rules should be adhered to:
For a more detailed treatment of the PCB layout for semtech devices please see application note AN1200.04 “RF design
guidelines: PCB layout and circuit optimization”.
SX1230, Revision 2 May 2009
©2008 Semtech Corp.
ADVANCED COMMUNICATIONS & SENSING
When designing the a PCB layout for the SX1230 the use of at least two metallized layers is advised, one side forming
the populated (component) layer, the second forming a continuous ground plane. Ideally this ground plane should be
unbroken and be situated beneath the SX1230 circuit and RF signal path. Adopting this layout strategy minimizes the
potential for spurious emission from, and coupling to, the SX1230.
Decoupling components should be located as close as possible to the SX1230, ideally each with its own via connection
direct to the ground plane.
The crystal oscillator circuit is differential, so benefits from both symmetrical layout and proximity to the SX1230.
The RF signal path should be kept as straight as possible, ideally duplicating the SX1230 reference design (SM1230).
Figure 21. Direct TCXO Connection
32 MHz
TCXO
GND
XTA
OP
Page 34
Vcc
XTB
NC
SX1230
C
D
Vcc
D
.
Integrated Transmitter IC
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