MPXV7002DP Freescale Semiconductor, MPXV7002DP Datasheet

PRESSURE SENSOR DUAL PORT 8-SOP

MPXV7002DP

Manufacturer Part Number
MPXV7002DP
Description
PRESSURE SENSOR DUAL PORT 8-SOP
Manufacturer
Freescale Semiconductor
Series
MPXV7002r
Datasheet

Specifications of MPXV7002DP

Pressure Type
Differential
Operating Pressure
±0.3 PSI
Port Size
Male, 0.13" (3.302mm) Tube, Dual
Output
0 ~ 4.5V
Voltage - Supply
4.75 V ~ 5.25 V
Termination Style
PCB
Operating Temperature
10°C ~ 60°C
Package / Case
8-SOP Dual Port
Accuracy
2.5 %
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 60 C
Minimum Operating Temperature
+ 10 C
Operating Supply Voltage
5 V
Supply Voltage (min)
4.75 V
Supply Voltage (max)
5.25 V
Supply Current
10 mA
Output Voltage
4.5 V
Shutdown
No
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPXV7002DP
Manufacturer:
FREESCALE
Quantity:
2 000
Part Number:
MPXV7002DP
Manufacturer:
FREESCA
Quantity:
191
Freescale Semiconductor
© Freescale Semiconductor, Inc., 2005, 2009. All rights reserved.
+
monolithic silicon pressure sensors designed for a wide range of applications,
but particularly those employing a microcontroller or microprocessor with A/D
inputs. This transducer combines advanced micromachining techniques, thin-
film metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Features
Small Outline Package (MPXV7002 Series)
MPXV7002GC6U
MPXV7002GC6T1
MPXV7002GP
MPXV7002DP
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
The MPXV7002 series piezoresistive transducers are state-of-the-art
2.5% Typical Error over +10°C to +60°C with Auto Zero
6.25% Maximum Error over +10°C to +60°C without Auto Zero
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Thermoplastic (PPS) Surface Mount Package
Temperature Compensated over +10° to +60°C
Patented Silicon Shear Stress Strain Gauge
Available in Differential and Gauge Configurations
Device Name
Tape & Reel
Package
Options
Trays
Trays
Rails
MPXV7002GC6U/C6T1
CASE 482A-01
Case
482A
482A
1369
1351
No.
SMALL OUTLINE PACKAGE
ORDERING INFORMATION
None
# of Ports
CASE 1369-01
MPXV7002GP
Single
Dual
Gauge
CASE 1351-01
MPXV7002DP
Application Examples
Pressure Type
Hospital Beds
HVAC
Respiratory Systems
Process Control
Differential
-2 to 2 kPa (-0.3 to 0.3 psi)
MPXV7002
0.5 to 4.5 V Output
Series
Absolute
Pressure
Rev 2, 1/2009
MPXV7002G
MPXV7002G
MPXV7002G
MPXV7002DP
MPXV7002
Marking
Device

MPXV7002DP Summary of contents

Page 1

... Rev 2, 1/2009 MPXV7002 Series - kPa (-0.3 to 0.3 psi) 0.5 to 4.5 V Output Application Examples • Hospital Beds • HVAC • Respiratory Systems • Process Control Pressure Type Device Marking Gauge Differential Absolute MPXV7002G • MPXV7002G • MPXV7002G • MPXV7002DP • MPXV7002DP CASE 1351-01 ...

Page 2

... FSO 3.5 4.0 4.5 V FSS ±2.5 (7) ±6.25 — — — 1.0 —- t — 1.0 —- R — 0.1 —- O+ — — 20 — 25°C. FSS Freescale Semiconductor Unit kPa Vdc mAdc Vdc Vdc Vdc %V FSS V/kPa ms mAdc ms Sensors ...

Page 3

... Storage Temperature Operating Temperature 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Sensing Element Figure 1. Integrated Pressure Sensor Schematic Sensors Freescale Semiconductor Symbol P max T stg ...

Page 4

... Differential Sensing Element Figure 2. Cross-Sectional Diagram SOP (not to scale out V s IPS 1.0 µF 0.01 µF GND shows the recommended decoupling circuit for shows the sensor output signal relative to Figure Stainless Steel Cap Thermoplastic Case Die Bond OUTPUT 470 pF Freescale Semiconductor 3. Sensors ...

Page 5

... Part Number MPXV7002GC6U/GC6T1 MPXV7002GP MPXV7002DP MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package ...

Page 6

... BSC 2.54 BSC H 0.002 0.010 0.05 0.25 J 0.009 0.011 0.23 0.28 K 0.061 0.071 1.55 1.80 M 0˚ 7˚ 0˚ 7˚ N 0.444 0.448 11.28 11.38 S 0.709 0.725 18.01 18.41 V 0.245 0.255 6.22 6.48 W 0.115 0.125 2.92 3.17 -T- SEATING PLANE Sensors Freescale Semiconductor ...

Page 7

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE Pressure MPXV7002 7 ...

Page 8

... Pressure MPXV7002 8 PACKAGE DIMENSIONS Sensors Freescale Semiconductor ...

Page 9

... Sensors Freescale Semiconductor PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Pressure MPXV7002 9 ...

Page 10

... Pressure MPXV7002 10 PACKAGE DIMENSIONS CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE Sensors Freescale Semiconductor ...

Page 11

... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...

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