MCIMX286CVM4B Freescale Semiconductor, MCIMX286CVM4B Datasheet - Page 31

no-image

MCIMX286CVM4B

Manufacturer Part Number
MCIMX286CVM4B
Description
IC MPU I.MX286 289MAPBGA
Manufacturer
Freescale Semiconductor
Series
i.MX28r

Specifications of MCIMX286CVM4B

Core Processor
ARM9
Core Size
32-Bit
Speed
454MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, MMC, SmartCard, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Program Memory Size
128KB (32K x 32)
Program Memory Type
Mask ROM
Ram Size
32K x 32
Voltage - Supply (vcc/vdd)
1.25 V ~ 5.25 V
Data Converters
A/D 17x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
289-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of I /o
-
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant
3.4.3.2
Figure 6
DDR2 (1.8 V), and LVDDR2 (1.5 V)
Freescale Semiconductor
DDR10
DDR11
DDR12
DDR13
DDR4
DDR5
ID
ID
and
Positive DQS latching edge to associated CK edge
DQS falling edge from CK rising edge—hold time
DQS falling edge to CK rising edge—setup time
DQS output high pulse width
EMI_CLKN
EMI_CLK
EMI_DQSN
EMI_DQS
EMI_DQ & EMI_DQM
Table 35
DDR Output AC Timing
Address and control output setup time
Address and control output hold time
i.MX28 Applications Processor Data Sheet for Consumer Products, Rev. 0
show the DDR output AC timing defined for all DDR types: LPDDR1, standard
Table 34. EMI Command/Address AC Timing (continued)
Description
Description
Figure 6. DDR Output AC Timing
Table 35. DDR Output AC Timing
DDR10
DDR13
Symbol
d0
tIS
tIH
d1
DDR11
DDR15
tDSH
tDSS
tDQSH
tDQSS
Symbol
DDR16
d2
0.5 tCK – 1
0.5 tCK – 1
DDR14
Min.
d3
–0.5
0.5 tCK
–0.5
0.5 tCK
–0.5
0.5 tCK
–0.5
DDR12
Min
0.5 tCK
0.5 tCK
0.5 tCK
+ 0.5
0.5 tCK
+ 0.5
0.5 tCK
+ 0.5
0.5
Max.
+ 0.5
+ 0.5
Max
ns
ns
ns
ns
Unit
Unit
ns
ns
31

Related parts for MCIMX286CVM4B