MCIMX513DJM8CR2 Freescale Semiconductor, MCIMX513DJM8CR2 Datasheet - Page 69
MCIMX513DJM8CR2
Manufacturer Part Number
MCIMX513DJM8CR2
Description
IC MPU I.MX51 529MABGA
Manufacturer
Freescale Semiconductor
Series
i.MX51r
Datasheet
1.MCIMX512DJM8C.pdf
(200 pages)
Specifications of MCIMX513DJM8CR2
Core Processor
ARM Cortex-A8
Core Size
32-Bit
Speed
800MHz
Connectivity
1-Wire, EBI/EMI, Ethernet, I²C, IrDA, MMC, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
128
Program Memory Type
ROMless
Ram Size
128K x 8
Voltage - Supply (vcc/vdd)
0.8 V ~ 1.15 V
Oscillator Type
External
Operating Temperature
-20°C ~ 85°C
Package / Case
529-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Data Converters
-
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1. Test conditions are: Capacitance 15 pF for DDR PADS. Recommended drive strengths is medium for SDCLK and high for
2. SDRAM CLK and DQS related parameters are being measured from the 50% point. that is, high is defined as 50% of signal
3. Test conditions are: Capacitance 15 pF for DDR PADS. Recommended drive strengths is medium for SDCLK and high for
4. SDRAM CLK and DQS related parameters are being measured from the 50% point. that is, high is defined as 50% of signal
Freescale Semiconductor
address and controls.
value and low is defined as 50% as signal value. DDR SDRAM CLK parameters are measured at the crossing point of SDCLK
and SDCLK (inverted clock).
address and controls.
value and low is defined as 50% as signal value. DDR SDRAM CLK parameters are measured at the crossing point of SDCLK
and SDCLK (inverted clock).
i.MX51 Applications Processors for Consumer and Industrial Products, Rev. 4
Table 62. Derating values for DDR2 Single Ended DQS
Table 61. Derating values for DDR2 Differential DQS
1
,
3
2
,
4
Electrical Characteristics
69
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