TEMD7000X01 Vishay, TEMD7000X01 Datasheet - Page 4

• Manufacturer Part Number: TEMD7000X01
• Description: Photodiodes 60V 215mW 60Deg PIN Photodiode
• Manufacturer: Vishay
• Type: PIN Photodioder

Specifications of TEMD7000X01

• Lens Type: Transparent
• Photodiode Material: Silicon
• Peak Wavelength: 900 nm
• Half Intensity Angle Degrees: 60 deg
• Maximum Reverse Voltage: 60 V
• Maximum Power Dissipation: 215 mW
• Maximum Light Current: 3 uA
• Maximum Dark Current: 10 nA
• Maximum Rise Time: 100 ns
• Maximum Fall Time: 100 ns
• Package / Case: 0805
• Wavelength Typ: 900nm
• Half Angle: 60°
• Dark Current: 1nA
• Diode Case Style: 0805
• No. Of Pins: 2
• Operating Temperature Range: -40°C To +100°C
• Msl: MSL 3 - 168 Hours
• Reverse Voltage Vr: 60V
• Termination Type: SMD
• Collector Dark Current: 10nA
• Rohs Compliant: Yes
• Svhc: No SVHC (20-Jun-2011)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

TEMD7000X01
Vishay Semiconductors
REFLOW SOLDER PROFILE
PACKAGE DIMENSIONS in millimeters
www.vishay.com
4
Fig. 8 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
19841
300
250
200
150
100
50
0
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
50
max. 120 s
20018
100
Time (s)
150
For technical questions, contact:
max. 100 s
max. 30 s
200
max. 260 °C
250
245 °C
300
Silicon PIN Photodiode
[e-mail]
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
amb
< 30 °C, RH < 60 %
Document Number: 81951
Rev. 1.3, 28-Sep-10