PC123YA2J00F Sharp Microelectronics, PC123YA2J00F Datasheet - Page 11

• Manufacturer Part Number: PC123YA2J00F
• Description: Transistor Output Optocouplers Die shrink version PC123AJ0000F
• Manufacturer: Sharp Microelectronics

Specifications of PC123YA2J00F

• Maximum Fall Time: 18 us
• Maximum Input Diode Current: 50 mA
• Maximum Reverse Diode Voltage: 6 V
• Maximum Rise Time: 18 us
• Output Device: Transistor
• Output Type: DC
• Configuration: 1
• Input Type: DC
• Maximum Collector Emitter Voltage: 70 V
• Maximum Collector Emitter Saturation Voltage: 200 mV
• Isolation Voltage: 5000 Vrms
• Current Transfer Ratio: 400 %
• Maximum Forward Diode Voltage: 1.4 V
• Maximum Collector Current: 50 mA
• Maximum Power Dissipation: 200 mW
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 30 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

■ Manufacturing Guidelines
● Soldering Method
Refl ow Soldering :
Flow Soldering :
Hand soldering
Other notice
Refl ow soldering should follow the temperature profi le shown below.
Soldering should not exceed the curve of temperature profi le and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the
below listed guidelines.
Flow soldering should be completed below 270̊C and within 10s.
Preheating is within the bounds of 100 to 150̊C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400̊C.
Please don't solder more than twice
Please test the soldering method in actual condition and make sure the soldering works fine, since
the impact on the junction between the device and PCB varies depending on the tooling and soldering
conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
(package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
11
3
Reflow
220˚C or more, 60s or less
4
PC123N02J00F Series
(min)
Sheet No.: D2-A09401EN