ECG008B-G TriQuint, ECG008B-G Datasheet - Page 4

• Manufacturer Part Number: ECG008B-G
• Description: RF Amplifier DC-4 GHz +24dBm P1dB@1 GHz
• Manufacturer: TriQuint
• Type: Buffer Amplifierr

Specifications of ECG008B-G

• Mounting Style: SMD/SMT
• Number Of Channels: 1
• Operating Frequency: 4000 MHz
• Noise Figure: 4.8 dB @ 2000 MHz
• Operating Supply Voltage: 7.3 V
• Supply Current: 120 mA (Typ) @ 9 V
• Maximum Operating Temperature: + 160 C
• Minimum Operating Temperature: - 40 C
• Package / Case: SOT-89
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 1066909

WJ Communications, Inc • Phone 1-800-WJ1-4401 • FAX: [phone] • e-mail: [e-mail] • Web site: www.wj.com, www.TriQuint.com
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
ECG008
InGaP HBT Gain Block
E008G
XXXX-X
(maximum 260 °C reflow temperature) and leaded (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
ECG008B-G Mechanical Information
Specifications and information are subject to change without notice
The component will be marked with an
“E008G” designator with an alphanumeric lot
code on the top surface of the package. The
obsolete tin-lead package is marked with an
“E008”
alphanumeric lot code; it may also have been
marked with an “6” designator followed by a
3-digit numeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD Rating: Class 1A
Value:
Test:
Standard:
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
1. Ground / thermal vias are critical for the proper performance of
2. Add as much copper as possible to inner and outer layers near
3. Mounting screws can be added near the part to fasten the board
4. Do not put solder mask on the backside of the PC board in the
5. RF trace width depends upon the PC board material and
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
Mounting Config. Notes
this device. Vias should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter of .25 mm (.010”).
the part to ensure optimal thermal performance.
to a heatsink.
contacts the heatsink.
region where the board contacts the heatsink.
construction.
degrees.
MSL / ESD Rating
Product Marking
designator
Passes between 250 and 500V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
JEDEC Standard J-STD-020
Ensure that the ground / thermal via region
followed
Page 4 of 4 January 2008
by
an