4593-PA-H1K-01800 Laird Technologies
4593-PA-H1K-01800
Manufacturer Part Number
4593-PA-H1K-01800
Description
EMI Gaskets & Grounding Pads FoF C-Fold L18 x H 0.25 xW0.28
Manufacturer
Laird Technologies
Type
Fabric over Foam Gasketsr
Specifications of 4593-PA-H1K-01800
Product
EMI/RFI Gaskets
Length
457.2 mm
Width
7.11 mm
Thickness
6.35 mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Related parts for 4593-PA-H1K-01800
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
GASKET FABRIC/FOAM C-FOLD
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
Bluetooth Serial Module Development Kit
Manufacturer:
Laird Technologies
Part Number:
Description:
BLUETOOTH MODULE DEVELOPMENT KIT
Manufacturer:
Laird Technologies
Part Number:
Description:
Bluetooth 2.0 AT Data Module, Internal Antenna Development Kit
Manufacturer:
Laird Technologies
Part Number:
Description:
BLUETOOTH EVAL BOARD BTM511
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
Bluetooth / 802.15.1 Modules & Development Tools BLUETTH Multimed MODLE, No ANT DEVKIT
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
DEV KIT PRM122
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
DEV KIT PRM123
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
KIT FOR PRM112
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
DEV KIT PRM121
Manufacturer:
Laird Technologies
Datasheet:
Part Number:
Description:
CHOKE COMMON MODE 110 OHMS SMD
Manufacturer:
Laird Technologies
Datasheet: