BLM18RK221SN1D Murata, BLM18RK221SN1D Datasheet - Page 186
BLM18RK221SN1D
Manufacturer Part Number
BLM18RK221SN1D
Description
EMI/RFI Suppressors & Ferrites 0603 220ohms Digital Interface Tape
Manufacturer
Murata
Datasheet
1.BLM18RK221SN1D.pdf
(215 pages)
Specifications of BLM18RK221SN1D
Shielding
Unshielded
Test Frequency
100 MHz
Product
Chip Ferrite Beads
Impedance
220 Ohms
Tolerance
25 %
Maximum Dc Current
200 mAmps
Maximum Dc Resistance
0.3 Ohms
Operating Temperature Range
- 55 C to + 125 C
Package / Case
0603 (1608 metric)
Termination Style
SMD/SMT
Dc Resistance Max
0.3ohm
Dc Current Rating
200mA
Ferrite Mounting
SMD
Ferrite Case Style
0603 / 1608
Operating Temperature Max
+125°C
Operating Temperature Min
-55°C
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BLM18RK221SN1D
Manufacturer:
MURATA
Quantity:
240 000
Part Number:
BLM18RK221SN1D
Manufacturer:
MURATA/村田
Quantity:
20 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
184
EMIFILr (Soldering and Mounting)
DLP
DLW
DLM
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
*Solderability is subject to reflow conditions and
thermal conductivity. Please make sure that your
product has been evaluated in view of your
specifications with our product being mounted to your
product.
DLP0NS
DLP11S
DLP31S
DLM11G
DLP2AD/31D
DLP0NS/11S/31S/DLM11G
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using
DLP/DLM series with Sn-Zn based solder, please
contact Murata in advance.
100-150 m: DLW21S/21H/31S,
150-200 m: DLP31D/31S, DLM2HG,
DLW5AH/5BS/5BT
Series
c
d
a
5.5
2.9
0.9
b
0.3
0.7
1.0
0.5
a
0.55
0.3
0.6
0.5
DLP0NS/11S/2AD
DLW5AH/5BS/5BT
a
b
Solder Paste Printing
0.3
0.3
0.7
0.4
c
0.55
0.5
2.1
0.7
d
DLW21S/H
DLW31S
DLP2AD
DLP31D
Series
Series
DLW21S/21H/31S
DLM2HG
a
b
0.55
1.0
a
0.8
1.6
a
0.4
0.8
b
2.6
3.7
1.0
4.0
b
0.25
0.4
0.5
0.4
c
c
0.5
0.8
1.2
1.6
d
d
DLP31S/DLM2HG
Apply 0.3mg of bonding agent at each chip.
Coating Position of
Bonding Agent
Coating Position of
Bonding Agent
DLP31D
Adhesive Application
Continued on the following page.
DLM2HG
Coating Position of
DLP31S
Bonding Agent
(in mm)
C31E.pdf
08.9.1
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