FC0402E50R0BSWS Vishay, FC0402E50R0BSWS Datasheet - Page 2
FC0402E50R0BSWS
Manufacturer Part Number
FC0402E50R0BSWS
Description
High Frequency/RF Resistors 50ohms 0.1% 25PPM
Manufacturer
Vishay
Series
FCr
Type
High Frequency Surface Mount Chip Resistorr
Specifications of FC0402E50R0BSWS
Resistance
50 Ohms
Power Rating
50 mWatts
Temperature Coefficient
+/- 25 PPM / C
Tolerance
0.1 %
Package / Case
0402 (1005 metric)
Frequency
20 GHz
Voltage Rating
30 Volts
Operating Temperature Range
- 55 C to + 125 C
Termination Style
SMD/SMT
Dimensions
0.5 mm W x 1 mm L x 0.38 mm H
Resistance Tolerance
± 0.1%
Resistor Element Material
Thin Film
Resistor Case Style
0402
No. Of Pins
2
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
FC
Vishay Thin Film
Note
(1)
www.vishay.com
74
GLOBAL
MODEL
DIMENSIONS in inches (millimeters)
MECHANICAL SPECIFICATIONS
Resistive Element
Substrate Material
Terminations
Lead (Pb)-free Option
Tin/Lead Option
Lead (Pb)-free Finish and Tin/Lead
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: FC1206E1001BBTS
Historical Part Number example: FC1206E1001BBT (for reference purposes only)
Preferred packaging code
F
F
FC
SERIES
FC
C
C
CASE
SIZE
0402
0505
0603
0805
1005
1206
L
L
1
1
CHARACTERISTIC
E = 25 ppm/°C
H = 50 ppm/°C
K = 100 ppm/°C
CASE SIZE
1206
TCR
2
2
D
D
E
W
T
0
0
High Frequency (up to 20 GHz) Resistor,
CHARACTERISTIC
The first 3 digits
are
figures and the
last digit specifies
the
zeros to follow.
“R”
the decimal point.
Example:
10R0 = 10 Ω
1000 = 100 Ω
1001 = 1 kΩ
For technical questions, contact:
RESISTANCE
6
6
Thin Film Surface Mount Chip
T
number
designates
TCR
significant
E
K
E
CASE
SIZE
0402
0505
0603
0805
1005
1206
of
1
1
TOLERANCE
(1.016 ± 0.076)
(1.270 ± 0.127)
(1.626 ± 0.153)
(2.032 ± 0.153)
(2.540 ± 0.204)
(3.201 ± 0.204)
0.040 ± 0.003
0.050 ± 0.005
0.064 ± 0.006
0.080 ± 0.006
0.100 ± 0.008
0.126 ± 0.008
B = 0.1 %
D = 0.5 %
F = 1 %
G = 2 %
J = 5 %
LENGTH
RESISTANCE
0
0
1001
thinfilm@vishay.com
0
0
T = Top sided Au (gold) term
B = Wraparound Sn/Pb solder
G = Wraparound Au over Ni (gold)
TB = Top sided Sn/Pb solder
TBS = Top sided lead (Pb)-free
S = Wraparound
W (± 0.005)
WIDTH
Au over Ni epoxy bondable
RoHS compliant - e4
63 % Sn/37 % Pb w/nickel
barrier
termination epoxy bondable
RoHS compliant - e4
lead (Pb)-free solder
96.5 % Sn/3.0 % Ag/0.5 %Cu
RoHS compliant - e1
(0.508)
(1.270)
(0.813)
(1.270)
(1.347)
(1.601)
0.020
0.050
0.032
0.050
0.053
0.063
63 % Sn/37 % Pb w/nickel
barrier
solder w/nickel barrier
RoHS compliant - e1
TOLERANCE
1
0
(1, 2 or 3 digits)
TERMINATION
96.5 % Sn, 3.0 % Ag, 0.5 % Cu
B
THICKNESS
MIN./MAX.
B
B
Passivated nichrome
Pre-soldered or gold
(0.381)
(0.381)
(0.381)
(0.381)
(0.635)
(0.635)
0.015
0.015
0.015
0.015
0.025
0.025
Hot solder dip
Alumina
T
Sn63
TERMINATION
(0.407 ± 10.53)
0.016 ± 0.008
D (± 0.005)
TOP PAD
B
B
B
(0.305)
(0.305)
(0.305)
0.012
0.012
0.012
(0.508 + 0.127/- 0.254)
(0.508 + 0.127/- 0.254)
BS = BULK
WS = WAFFLE
TAPE AND REEL
T0 = 100 min., 100 mult
T1 = 1000 min., 1000 mult
T3 = 300 min., 300 mult
T5 = 500 min., 500 mult
TF = Full reel
TS = 100 min., 1 mult
0.020 + 0.005/- 0.010
0.020 + 0.005/- 0.010
Document Number: 60093
S
100 min., 1 mult
100 min., 1 mult
PACKAGING
Revision: 24-Nov-10
PACKAGING
BOTTOM PAD
T
T
E (± 0.005)
(0.381)
(0.381)
(0.381)
(0.381)
0.015
0.015
0.015
0.015
T
S
S
(1)