SC900841JVK Freescale Semiconductor, SC900841JVK Datasheet - Page 190
![IC POWER MGT 338-MAPBGA](/photos/39/29/392926/pbga338_sml.jpg)
SC900841JVK
Manufacturer Part Number
SC900841JVK
Description
IC POWER MGT 338-MAPBGA
Manufacturer
Freescale Semiconductor
Specifications of SC900841JVK
Applications
PC's, PDA's
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
338-TBGA
Input Voltage
2.8 V to 4.4 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Supply
-
Voltage - Supply
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
SC900841JVK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
SC900841JVKR2
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
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PACKAGE MECHANICAL OUTLINE DRAWING
profile PBGA. The package has a semi populated matrix that
includes 338 balls. The ball count includes 322 assigned
signal pins and four sets of 4 corner balls.
PACKAGE ASSEMBLY RECOMENDATIONS
190
900841
PACKAGING
The package style is an 11x11 fine interstitial pitch, thin
For improved protection against mechanical shock,
mounted SC900841 BGA package. This corner glue
application is described in the AN3954 - "PCB Layout
Guidelines for SC900841 and SCCSP900842 application
note.
application is the Loctite 3128 board level adhesive applied
at a 0° or 45° dispense angle in a continuous motion and with
the fillet length extended to a minimum of 3 ball rows and
columns at each corner.
Freescale recommends applying corner glue to the
Freescale’s preferred material for the corner glue
Analog Integrated Circuit Device Data
Freescale Semiconductor
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