DSPIC30F5011-30I/PTG Microchip Technology, DSPIC30F5011-30I/PTG Datasheet - Page 209
DSPIC30F5011-30I/PTG
Manufacturer Part Number
DSPIC30F5011-30I/PTG
Description
16BIT MCU-DSP 30MHZ, SMD, 30F5011
Manufacturer
Microchip Technology
Series
DsPIC30Fr
Datasheet
1.DSPIC30F5011-30IPTG.pdf
(220 pages)
Specifications of DSPIC30F5011-30I/PTG
Core Frequency
30MHz
Embedded Interface Type
CAN, I2C, SPI, UART
No. Of I/o's
52
Flash Memory Size
66KB
Supply Voltage Range
2.5V To 5.5V
Operating Temperature Range
-40°C To
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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80-Lead Plastic Thin Quad Flatpack (PT) 12x12x1 mm Body, 1.0/0.10 mm Lead Form (TQFP)
2004 Microchip Technology Inc.
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Foot Length
Footprint (Reference)
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Pin 1 Corner Chamfer
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-026
Drawing No. C04-092
c
B
p
#leads=n1
Dimension Limits
E1
E
Units
CH
(F)
A2
E1
D1
n1
A1
D
p
A
L
E
B
n
c
n
MIN
Preliminary
.039
.037
.463
.463
.004
.025
2
1
.002
.018
.007
.541
.541
D1
0
5
5
L
CH x 45
INCHES
D
NOM
A1
.020
.043
.039
.004
.024
.039
.472
.472
.006
.009
.035
.551
.551
3.5
80
20
10
10
A
dsPIC30F5011/5013
MAX
.047
.006
.030
.482
.482
.008
.045
.041
.561
.561
.011
15
15
7
(F)
MIN
13.75
13.75
11.75
11.75
1.00
0.95
0.05
0.45
0.09
0.17
0.64
MILLIMETERS*
0
5
5
NOM
14.00
14.00
12.00
12.00
0.50
1.10
1.00
0.10
0.60
1.00
0.15
0.22
0.89
3.5
80
20
10
10
DS70116C-page 207
MAX
A2
14.25
14.25
12.25
12.25
1.20
1.05
0.15
0.75
0.20
0.27
1.14
15
15
7
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