XC2C384-10TQG144C Xilinx Inc, XC2C384-10TQG144C Datasheet - Page 2

IC, CPLD, 384 MACROCELL, 7.1NS, TQFP-144

XC2C384-10TQG144C

Manufacturer Part Number
XC2C384-10TQG144C
Description
IC, CPLD, 384 MACROCELL, 7.1NS, TQFP-144
Manufacturer
Xilinx Inc
Series
CoolRunner IIr
Datasheets

Specifications of XC2C384-10TQG144C

No. Of Macrocells
384
No. Of I/o's
118
Propagation Delay
7.1ns
Global Clock Setup Time
3.3ns
Frequency
125MHz
Supply Voltage Range
1.7V To 1.9V
Programmable Type
In System Programmable
Delay Time Tpd(1) Max
9.2ns
Voltage Supply - Internal
1.7 V ~ 1.9 V
Number Of Logic Elements/blocks
24
Number Of Macrocells
384
Number Of Gates
9000
Number Of I /o
118
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
144-TQFP, 144-VQFP
Features
JTAG
Voltage
1.8V
Memory Type
CMOS
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Logic Elements/cells
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
122-1406

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0
CoolRunner-II CPLD Family
Table 2: CoolRunner-II CPLD DC Characteristics
Table 2
family.
Table 3
with corresponding I/O count. All packages are surface
mount, with over half of them being ball-grid technologies.
The ultra tiny packages permit maximum functional capacity
in the smallest possible area. The CMOS technology used
Table 3: CoolRunner-II CPLD Family Packages and I/O Count
Table 4
the CoolRunner-II CPLD family. The family has uniform
basic features with advanced features included in densities
where they are most useful. For example, it is very unlikely
2
1.
Notes:
1.
I
I
QFG32
VQ44
VQG44
QFG48
CP56
CPG56
VQ100
VQG100
CP132
CPG132
TQ144
TQG144
PQ208
PQG208
FT256
FTG256
FG324
FGG324
CC
CC
I
The letter "G" as the third character indicates a Pb-free package.
(μA), 0 MHz, 25°C (typical)
(mA), 50 MHz, 70°C (max)
CC
shows key DC characteristics for the CoolRunner-II
details the distribution of advanced features across
is dynamic current.
shows the CoolRunner-II CPLD package offering
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
(1)
XC2C32A
21
33
33
33
33
-
-
-
-
-
-
-
-
-
-
-
-
-
XC2C64A
33
33
37
45
45
64
64
XC2C32A
-
-
-
-
-
-
-
-
-
-
-
2.5
16
XC2C128
100
100
100
100
XC2C64A
80
80
-
-
-
-
-
-
-
-
-
-
-
-
17
5
www.xilinx.com
XC2C256
106
106
118
118
173
173
184
184
80
80
XC2C128
-
-
-
-
-
-
-
-
in CoolRunner-II CPLDs generates minimal heat, allowing
the use of tiny packages during high-speed operation.
With the exception of the Pb-free QF packages, there are at
least two densities present in each package with three in the
VQ100 (100-pin 1.0mm QFP), TQ144 (144-pin 1.4mm
QFP), and FT256 (256-ball 1.0mm spacing FLBGA). The
FT256 is particularly important for slim dimensioned porta-
ble products with mid- to high-density logic requirements.
that four I/O banks are needed on 32 and 64 macrocell
parts, but very likely they are for 384 and 512 macrocell
parts. The I/O banks are groupings of I/O pins using any
one of a subset of compatible voltage standards that share
19
10
XC2C384
118
118
173
173
212
212
240
240
XC2C256
-
-
-
-
-
-
-
-
-
-
21
27
XC2C512
173
173
212
212
270
270
-
-
-
-
-
-
-
-
-
-
-
-
XC2C384
DS090 (v3.1) September 11, 2008
45
23
Product Specification
XC2C512
25
55
R

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