DSPIC30F4012-20E/SP Microchip Technology, DSPIC30F4012-20E/SP Datasheet - Page 222
DSPIC30F4012-20E/SP
Manufacturer Part Number
DSPIC30F4012-20E/SP
Description
IC,DSP,16-BIT,CMOS,DIP,28PIN,PLASTIC
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr
Datasheets
1.DSPIC30F2011-20ISO.pdf
(66 pages)
2.DSPIC30F4012-30ISO.pdf
(238 pages)
3.DSPIC30F4012-30ISO.pdf
(18 pages)
4.DSPIC30F4012-30ISO.pdf
(6 pages)
5.DSPIC30F4012-30ISO.pdf
(16 pages)
6.DSPIC30F4012-30ISO.pdf
(22 pages)
Specifications of DSPIC30F4012-20E/SP
Rohs Compliant
YES
Core Processor
dsPIC
Core Size
16-Bit
Speed
20 MIPS
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
20
Program Memory Size
48KB (16K x 24)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 6x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
DSPIC30F401220ESP
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F4012-20E/SP
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
- DSPIC30F2011-20ISO PDF datasheet
- DSPIC30F4012-30ISO PDF datasheet #2
- DSPIC30F4012-30ISO PDF datasheet #3
- DSPIC30F4012-30ISO PDF datasheet #4
- DSPIC30F4012-30ISO PDF datasheet #5
- DSPIC30F4012-30ISO PDF datasheet #6
- Current page: 222 of 238
- Download datasheet (4Mb)
dsPIC30F4011/4012
28-Lead Plastic Small Outline (SO) – Wide, 7.50 mm Body [SOIC]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. § Significant Characteristic.
3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
DS70135G-page 222
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
NOTE 1
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff §
Overall Width
Molded Package Width
Overall Length
Chamfer (optional)
Foot Length
Footprint
Foot Angle Top
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
N
1 2 3
b
D
Dimension Limits
e
Units
A2
E1
A2
A1
E1
L1
N
A
E
D
α
e
h
L
φ
c
b
β
α
E
MIN
2.05
0.10
0.25
0.40
0.18
0.31
φ
0°
5°
5°
–
L1
L
MILLMETERS
10.30 BSC
17.90 BSC
1.27 BSC
7.50 BSC
1.40 REF
h
NOM
28
–
–
–
–
–
–
–
–
–
–
Microchip Technology Drawing C04-052B
h
© 2010 Microchip Technology Inc.
MAX
2.65
0.30
0.75
1.27
0.33
0.51
15°
15°
β
8°
–
c
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