PIC16F76-E/SP Microchip Technology, PIC16F76-E/SP Datasheet - Page 9
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PIC16F76-E/SP
Manufacturer Part Number
PIC16F76-E/SP
Description
28 PIN, 14KB STD FLASH, 368 RAM, 22 I/O,
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F818-ISO.pdf
(6 pages)
4.PIC16F73-ISP.pdf
(174 pages)
5.PIC16F73-ISP.pdf
(14 pages)
6.PIC16F73-ISP.pdf
(12 pages)
Specifications of PIC16F76-E/SP
Rohs Compliant
YES
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Ram Size
368 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16F76E/SP
FIGURE 3:
2003 Microchip Technology Inc.
44-Lead Plastic Quad Flat No Lead Package (ML) 8x8 mm Body (QFN)
A1
Number of Pins
Pitch
Overall Height
Standoff
Base Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Lead Width
Lead Length
Drawing No. C04-103
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.
JEDEC equivalent: M0-220
44-PIN QFN PACKAGE (DRAWING 1, PACKAGING)
OPTIONAL PIN 1
TOP MARKING
INDEX ON
TOP VIEW
Dimension Limits
E
Units
A1
A3
E2
D2
A
E
D
B
n
p
L
n
MIN
2
1
EXPOSED PAD
.031
.000
.262
.262
.012
.014
A3
D
INDEX ON
A
INCHES
.026 BSC
.315 BSC
.315 BSC
.010 REF
PIN 1
NOM
D2
.035
.001
.268
.268
.013
.016
44
PIC16F73/74/76/77
MAX
EXPOSED
.039
.002
.274
.274
.013
.018
METAL
BOTTOM VIEW
PAD
MIN
E2
0.80
6.65
6.65
0.30
0.35
0
MILLIMETERS*
0.65 BSC
8.00 BSC
8.00 BSC
0.25 REF
NOM
0.90
0.02
6.80
6.80
0.33
0.40
44
L
DS80165A-page 9
MAX
p
B
1.00
0.05
6.95
6.95
0.35
0.45