ERT-J0ER104J Panasonic - ECG, ERT-J0ER104J Datasheet
ERT-J0ER104J
Specifications of ERT-J0ER104J
P13703TR
Related parts for ERT-J0ER104J
ERT-J0ER104J Summary of contents
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... Nominal Class Resistance Code Packaging Style Code Code Packaging Style φ180Reel, Paper Taping , 10000pcs./reel E B Value Rated Maximum Power 25/50 4250 K +/- 2 % No. 151S-ERTJ-KE52E PAGE DATE Jul 31, 2006 Table 1 Symbol Dimensions(mm) L 1.0 +/- 0.1 W 0.50 +/- 0.05 T 0.50 +/- 0.05 L1,L2 0.25 +/- 0.15 J Resistance Tol Code ...
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... All the materials used in this product are registered materials under the Law Concerning Examination and Regulation of Manufacture and Handling of Chemical Substances. (4) This product complies with the RoHS, DIRECTIVE 2002/95/EC on the Restriction of the use of certain Hazardous Substances in electrical and electronic equipment. (5) This product is subject to export procedures under export related laws and regulations such as the Foreign Exchange and Foreign Trade Law ...
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... Unless otherwise specified, all tests and measurements shall be made at a temperature 35℃ and at a relative humidity 75%. If results obtained are doubted, a further test should be carried out at a temperature of 25 +/- 2℃ and a relative humidity 70%. 8. Structure Fig. 1 (2) (1) Note ; SPECIFICATIONS (3) (4) No. 151S-ERTJ-SG07E PAGE DATE May 12, 2006 Nominal Resistance Symbol (Ex.) (ohm) 102 1000 103 10000 104 ...
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... EIA size 0201 : 0.3 mm Material of PCB : Alumina board (95% min.) or glass epoxy board. (Thickness/1.0mm min.) After soldering a specimen on the substrate (shown in Fig.3), 1mm of bending shall be applied for 5 seconds. Bending speed : 1mm continued ( ) No. 151S-ERTJ-SG07E PAGE DATE May 12, 2006 Test Method and R , shall be meas (deg.C) and T (deg ...
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... Test temperature Relative humidity : 85 +/-5 % Test period Specimens shall be soldered on the testing board ) : 25 shown in Fig.2. Test temperature Relative humidity : 85 +/-5 % Applied power Test period to be continued ( ) No. 151S-ERTJ-SG07E PAGE DATE May 12, 2006 Test Method : 3.0 +/-0.5 s Temp. Period Step (deg.C) ( 100 120 to 180 ...
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... Change of Zero-power Resistance (R Within +/-3% Change of B Value : Within +/-2% When uncertainty occurs in the climatic tests (temperature cycle, moisture resistance, damp heat load, cold resistance and dry heat re- sistance), the same tests shall be performed for the capacitor itself. Material : Glass epoxy board Thickness : 1.6mm : Copper foil (0 ...
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... The Maximum power that can be continuously applied under static air at a certain ambient temperature. The Maximum power dissipation under ambient temperature 25°C or less is the same with the rated maximum power dissipation, and Maximum power dissipation beyond 25°C depends on the right Decreased power dissipation curve. 【 ...
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... The lead wire of a component with lead wires Sectional view Chassis Solder (ground solder) Sectional view Lead wire of Retro-fitted component Sectional view Portion to be excessively soldered No. 151S-ERTJ-SS03E PAGE DATE May 12, 2006 Unit 0.3 0.2 to 0.3 0.25 to 0.3 0.2 to 0.3 0.5 0.4 to 0.5 ...
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... For double surface mounting, apply a supporting pin on the rear surface of the PC board to suppress the bending of the PC board in order to minimize the impact of the vacuum nozzles. Typical examples are shown in the following table. Note ; SPECIFICATIONS Perforation No. 151S-ERTJ-SS03E PAGE DATE May 12, 2006 Recommended layout Lay out the Thermistor ...
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... Soldering flux may seriously affect the performance of the Thermistors. The following shall be confirmed before use. (1) The soldering flux should have a halogen based content of 0.1 wt. % (converted to chlorine) or below. Do not use soldering flux with strong acid. (2) When applying water-soluble soldering flux, wash the Thermistors sufficiently because the soldering flux residue on the surface of PC boards may deteriorate the insulation resistance on the Thermistors’ ...
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... DT Preheating 60 to 120 s Note ; SPECIFICATIONS ④Peak ⑤Gradual cooling ③Heating Time 60 sec max. 〈Allowable temperature difference Gradual cooling 3 s max . No. 151S-ERTJ-SS03E PAGE DATE May 12, 2006 D 〈Allowable temperature difference T〉 Size Temp. Tol. 0201 to 0603 D T≦ 150 °C (EIA) D T〉 Size Temp ...
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... The following figures are for your reference to avoid bending the PC board. Bending of PC board Note ; SPECIFICATIONS Conditions of Hand soldering without preheating : 20 W/L max kHz max. 5 min. max. NG setting Check pin Separated, Crack No. 151S-ERTJ-SS03E PAGE DATE May 12, 2006 Condition 270 °C Max Max Max Max. Recommended setting Check pin ...
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... Other The various precautions described above are typical. For special mounting conditions, please contact us. Note ; SPECIFICATIONS NG dividing Load direction Load position PC board Chip component V-groove No. 151S-ERTJ-SS03E PAGE DATE May 12, 2006 Bending Torsion Recommended dividing Load direction V-groove PC board Load position Crack ...
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... Taping 1) The direction of winding of taping on the reel shall be in accordance with the following diagram. Fig. 1 Paper Taping Note : Panasonic Electronic Devices Co., Ltd. SPECIFICATIONS Quantity (pcs./reel) 15000 10000 4000 No. 151S-ERTJ-SV02E PAGE DATE May 12, 2006 APPROVAL CHECK DESIGN Y.Sakaguti T.Kawamura S. Inagaki ...
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... There shall be no barrs preventing suction when products are taken out. 4- 4.Missing of products The missing of products shall be 0.1% or less per reel and there shall be no continuous missing of products. 4- 5.Adherence to the tape Products shall not be stuck to the cover tape or bottom tape. Note ; SPECIFICATIONS 100mm min. 400mm min. No. 151S-ERTJ-SV02E PAGE DATE May 12, 2006 ...
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... B 0.67 +/- 0.05 Fig. 5 Carrier Tape Dimension (EIA 0603) Size EIA 0603 Code A 1.0 +/- 0.1 B 1.8 +/- 0.1 Note ; SPECIFICATIONS EIA 0402 0.62 +/- 0.05 1.12 +/- 0.05 No. 151S-ERTJ-SV02E PAGE DATE May 12, 2006 Code Dimension W 8.0 +/- 0.2 F 3.50 +/- 0.05 E 1.75 +/- 0.10 P 2.00 +/- 0. 2.00 +/- 0.05 ...
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... CLASSFICATION SUBJECT Multilayer Chip NTC Thermistors Taped and Reeled Packaging Specifications Fig. 6 Reel Dimension Note ; SPECIFICATIONS No. 151S-ERTJ-SV02E PAGE DATE May 12, 2006 Code Dimension f 180+0/-3 +/- 0 13.0 +/- 0.5 D 21.0 +/- 0.8 E 2.0 +/- 0.5 W 9.0 +/- 0.3 W 11.4 +/- 0.1 1 Unit : mm ...