NTCS0805E3104FXT Vishay, NTCS0805E3104FXT Datasheet - Page 7

• Manufacturer Part Number: NTCS0805E3104FXT
• Description: THERMISTOR NTC 100K OHM SMD 0805
• Manufacturer: Vishay

Specifications of NTCS0805E3104FXT

• Resistance In Ohms @ 25°c: 100K
• Resistance Tolerance: ±1%
• B Value Tolerance: ±1%
• B25/85: 4100K
• Operating Temperature: -40°C ~ 150°C
• Power - Max: 210mW
• Mounting Type: Surface Mount
• Package / Case: 0805 (2012 Metric)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• B0/50: -
• B25/50: -
• B25/75: -
• B25/100: -
• Lead Length: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Compliant
• Other names: BC2562TR

NTCS0805E3.....T
Vishay BCcomponents
SOLDERING CONDITIONS
This SMD thermistor is only suitable for wave or reflow soldering, in accordance with JEDEC J-STD-020. The maximum
temperature of 260 °C during 40 s should not be exceeded.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
TESTS AND REQUIREMENTS
PACKAGING
TAPE SPECIFICATIONS
All tape specifications are in accordance with IEC 60286-3. Basic dimensions are given below. Carrier tape material is paper.
PAPER TAPE
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22
THE PRODUCT DESCRIBED HEREIN AND THIS DATASHEET ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
SOLDERABILITY AND RESISTANCE TO SOLDERING HEAT
IEC 60068-2-58
300
250
200
150
100
50
0
6
D
0
0
≈ 245 °C
260 °C
215 °C
180 °C
130 °C
A
0
B
50
P
0
1
P
Reflow Soldering
TEST METHOD
2
2 K/s
P
0
100
T
C
Time (s)
150
For technical questions, contact:
10 s
10 s
F
E
JWB288
This datasheet is subject to change without notice.
40 s
1.3
1
Resistance to soldering heat
SMD 0805, Glass Protected
W
200
Solderability
Dimensions of the solder lands
NTC Thermistors
1.0
TEST
250
T
T
1
3.0
Notes
• Measured 0.3 mm above base pocket
• P
DIMENSIONS OF PAPER TAPE in millimeters
PARAMETER
A
B
W
E
F
D
P
P
P
T tape thickness
T
1
1
0
0
0
0
0
1
2
cover tape
pitch cumulative error over any 10 pitches ± 1.0 mm
[e-mail]
(1)
(1)
(2)
300
250
200
150
100
50
0
0
PROCEDURE
10 s at 260 °C
Lead (Pb)-free Reflow Soldering Profile
2 s at 235 °C
≈ 245 °C
≈ 170 °C
260 °C
235 °C
50
100
2 K/s
max.
≈ 120 °C
DIMENSION
150
Time (s)
< 0.1
2.35
1.75
1.55
Min. 95 % of surface wetted
1.7
8.0
3.5
4.0
4.0
2.0
1.1
200
www.vishay.com/doc?91000
REQUIREMENTS
Document Number: 29044
R/R < 5 %
250
20 s min.
40 s max.
Revision: 09-Mar-11
≈ 60 s
TOLERANCE
6 K/s
max.
limit
normal
300
± 0.05
± 0.05
± 0.05
± 0.2
± 0.1
± 0.2
± 0.1
± 0.1
± 0.1
Max.
-
350