C1608X7R1C103K TDK Corporation, C1608X7R1C103K Datasheet - Page 10

• Manufacturer Part Number: C1608X7R1C103K
• Description: CAP CER 10000PF 16V X7R 10% 0603
• Manufacturer: TDK Corporation
• Series: Cr

Specifications of C1608X7R1C103K

• Voltage - Rated: 16V
• Capacitance: 10000pF
• Tolerance: ±10%
• Temperature Coefficient: X7R
• Mounting Type: Surface Mount, MLCC
• Operating Temperature: -55°C ~ 125°C
• Features: Low ESR
• Applications: General Purpose
• Package / Case: 0603 (1608 Metric)
• Size / Dimension: 0.063" L x 0.031" W (1.60mm x 0.80mm)
• Thickness: 0.037" (0.95mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Ratings: -
• Lead Spacing: -
• Other names: 445-6855-2

TDK Multilayer Ceramic Chip Capacitors
Application Manual
3) Solder dip depth in the double wave method
Setting dip depth t in the double wave method
Primary solder: Greater immersion (prevents non soldered portions)
Second solder: Dip is shallower (draws in excess solder and prevents
Soldering by solder iron
Special attention must be given to the handling and temperature of the
soldering iron and the shape of the soldering iron. This is because it is
easy for the soldering iron to come into direct contact with the terminal
electrodes on the TDK multilayer ceramic chip causing multiple cracking
opportunities.
Make sure that the soldering iron does not come into contact with the
ceramic dielectric, only the terminations.
How to apply the soldering iron
Recommended conditions for soldering iron
Rated (W)
20max.
Important points
Secondary solder
solder bridges)
Soldering iron temperature (°C) Soldering iron shape (mm)
300max.
Appropriate quantity of solder
Molten solder
Ø
Primary solder
3.0max.
Excess amount of solder
Right amount of solder
Insufficient amount of solder
Recommended conditions for soldering iron temperatures
Solder amount
Too much or too little solder may cause serious consequences for circuit
reliability such as cracks from solder stress and parts falling off the circuit
board. Check the diagram and make sure to provide the right amount of
solder.
Cooling
We recommend natural cooling in the air, but if the parts will be dipped in
solvent for cleaning purposes, the temperature difference T should be
100°C or less.
Cleaning
Selection of cleaning fluid
When using rosin flux, cleaning is not usually necessary. When using
active flux, the cleaning fluid will separate the chlorine component from
the flux and that will have a bad effect on devices. Always use new cleaning
fluid for cleaning.
Ultrasonic cleaning
If the ultrasonic energy output is too high during ultrasound cleaning that
will affect the adhesion of terminal electrodes so we recommend the
following conditions for ultrasound cleaning:
Frequency: 28kHz Output: 20W// cleaning time: 5 min. or less
300
250
200
0
Soldering method
C3216 and under
C3225 and over
T
Pre-heating
Change in temperature( C)
Extremely short(within 2 seconds, if possible)
Maximum layer quantity
Minimum layer quantity
T = < 190
T = < 130
Adhesive strength is weak producing
danger of defective contacts and parts
coming off of board.
Increased occurrence of
solder stress and cracks
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