G4A01229C THERMODISC, G4A01229C Datasheet - Page 16

• Manufacturer Part Number: G4A01229C
• Description: FUSE, THERMAL, 229°C, 10A, 250V
• Manufacturer: THERMODISC
• Series: G4r

Specifications of G4A01229C

• Voltage Rating Vac: 250V
• Fuse Current: 10A
• Fuse Terminals: Ferrule
• Functioning Temperature: 229°C
• Holding Temperature: 200°C
• Fuse Size: 14.7 X 4.0mm
• Current Rating: 10A
• Voltage Rating: 250V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

.70 MIN. (17.8 mm)
.09 MIN.
(2.3 mm)
.04 MIN. RAD.
(1.0 mm)
Figure 14
Dimensions are shown in inches (millimeters).
Thermal Gradients
Ideal TCO placement subjects the entire TCO case, leads, epoxy seal and internal components to a
uniform temperature environment.
Care should be exercised in the placement of the TCO to minimize thermal gradients across the
TCO body. In certain applications, the TCO can be mounted in a position where heat is conducted
to the body of the TCO through one of the leads, resulting in thermal gradients across the TCO.
Over time, the TCO life can be reduced by thermal gradients if the isolated (epoxy) lead is at a
consistently lower temperature than the case lead. Long term testing is recommended in
determining whether these conditions exist in the application.
To minimize the effects of thermal gradients and the temperature increase of the TCO body from
this heat flow, attach the isolated (epoxy) lead, rather than the case lead, to the heat source.
TCO dummies can be supplied with thermocouples on both ends to facilitate gradient evaluations.
Temperature Limits
The temperatures experienced during normal operation, including expected temperature overshoots,
will determine the life expectancy of the TCO. Nuisance trips can result if the thermal cutoff rating
is too close to the temperatures experienced during normal operation. Thermal cutoffs of any
temperature rating should not be subjected to continuous normal temperatures in excess of
200°C. Additionally, overshoot temperatures after the opening of the thermal cutoff should be
minimized to avoid dielectric breakdown and reconduction of the thermal cutoff.
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