G4A01104C THERMODISC, G4A01104C Datasheet - Page 9

FUSE, THERMAL, 104°C, 10A, 250V

G4A01104C

Manufacturer Part Number
G4A01104C
Description
FUSE, THERMAL, 104°C, 10A, 250V
Manufacturer
THERMODISC
Series
MICROTEMPr
Datasheet

Specifications of G4A01104C

Voltage Rating Vac
250V
Fuse Current
10A
Fuse Terminals
Axial Leaded
Functioning Temperature
104°C
Holding Temperature
79°C
Length/height, External
14.7mm
Voltage Ac
250V
Current Rating
10A
Diameter
4mm
Length
14.7mm
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MICROTEMP
®
Thermal Cutoffs:
TECHNICAL DATA
MICROTEMP
®
thermal cutoffs, available in a variety of standard and custom configurations, pro-
vide reliable one-shot, over-temperature protection in a wide range of applications. Performance
can be affected by installation method and proper location of the thermal cutoff. Both application
and installation are important in the overall performance of the product, and thorough testing is
necessary for both AC and DC applications. The following guidelines will answer most questions
concerning these two subjects.
Application of Thermal Cutoffs
A thermal measurement procedure that utilizes a “dummy” thermal cutoff can assist in determining
the appropriate calibration temperature and design location of MICROTEMP
®
thermal cutoffs. The
dummy matches the electrical characteristics of the thermal cutoff but does not have thermally
responsive parts. The dummy is supplied with a thermocouple attached to the case of the thermal
cutoff (see figure 8).
Figure 8
View of required thermocouple attachment before soldering
Dummy cutoffs can be supplied with Type J, Type T or Type K thermocouples. Other thermocouple
types can usually be supplied upon request at a nominal charge.
Location
Sufficient time and effort must be used to determine the proper and most desirable location for a
thermal cutoff. The employment of infrared thermography, or a sufficient number of thermocouples
to identify the highest temperature areas in the product requiring protection during fault conditions,
should be considered.
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