LXHL-PM09 LUMILEDS, LXHL-PM09 Datasheet - Page 8

LED, HIGH BRIGHTNESS, GREEN, 3W, 64LM

LXHL-PM09

Manufacturer Part Number
LXHL-PM09
Description
LED, HIGH BRIGHTNESS, GREEN, 3W, 64LM
Manufacturer
LUMILEDS
Series
LUXEON IIIr
Datasheet

Specifications of LXHL-PM09

Led Color
Green
Luminous Flux @ Test
80lm
Wavelength Typ
550nm
Luminous Flux @ Max
80lm
Forward Current @ Test
1A
Forward Current If Max
1A
Forward Voltage @ Test
3.9V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LXHL-PM09
Manufacturer:
TDK-Lambda
Quantity:
15
Part Number:
LXHL-PM09
Manufacturer:
LUMILEDS
Quantity:
20 000
Notes for Table 10:
Notes for Table 11:
LUXEON III Emitter DS45 (3/06)
1.Lumileds maintains a tolerance of ± 0.06V on forward voltage measurements.
2.Dynamic resistance is the inverse of the slope in linear forward voltage model for LEDs. See Figure 3.
3.Measured between 25ºC ≤ T
1.Proper current derating must be observed to maintain junction temperature below the maximum. For more
2. Measured at leads, during lead soldering and slug attach, body temperature must not exceed 120ºC. Luxeon Emitters cannot
3.LEDs are not designed to be driven in reverse bias. Please consult Lumileds' Application Brief AB11 for further information.
information, consult the Luxeon Design Guide, available upon request.
be soldered by general IR or Vapor phase reflow, nor by wave soldering. Lead soldering is limited to selective heating of the
leads, such as by hot bar reflow, fiber focussed IR, or hand soldering. The package back plane (slug) may not be attached by
soldering, but rather with a thermally conductive adhesive. Electrical insulation between the slug and the board is required.
Please consult Lumileds' Application Brief AB10 on Luxeon Emitter Assembly Information for further details on assembly
methods.
Electrical Characteristics at 1400mA, Junction Temperature, T
Red Orange
Amber
C C o o l l o o r r
Red
Peak Pulsed Forward Current (mA)
LED Junction Temperature (ºC)
Average Forward Current (mA)
Soldering Temperature (ºC)
DC Forward Current (mA)
Storage Temperature (ºC)
ESD Sensitivity
P P a a r r a a m m e e t t e e r r
J
2.31
2.31
2.31
M M i i n n . .
≤ 110ºC at I
F F o o r r w w a a r r d d V V o o l l t t a a g g e e V V
[3]
Absolute Maximum Ratings
2.95
2.95
2.95
T T y y p p . .
[1]
F
[2]
= 1400mA.
F F
( ( V V ) )
M M a a x x . .
3.51
3.51
3.51
[ [ 1 1 ] ]
Table 10.
Table 11.
±16,000V HBM
5 seconds max
8
W W h h i i t t e e / / G G r r e e e e n n / /
C C y y a a n n / / B B l l u u e e / /
R R o o y y a a l l B B l l u u e e
40 to +120
R R e e s s i i s s t t a a n n c c e e
260 for
1000
1000
1000
D D y y n n a a m m i i c c
135
( ( Ω Ω ) ) R R
0.7
0.7
0.7
D D
[ [ 2 2 ] ]
C C o o e e f f f f i i c c i i e e n n t t o o f f
T T e e m m p p e e r r a a t t u u r r e e
±16,000V HBM
5 seconds max
∆ ∆ V V
V V o o l l t t a a g g e e
F F o o r r w w a a r r d d
R R e e d d O O r r a a n n g g e e / /
( ( m m V V / /
40 to +120
F F
2.0
2.0
2.0
260 for
A A m m b b e e r r
/ / ∆ ∆ T T
1540
2200
1400
R R e e d d / /
135
o o
C C ) )
[ [ 3 3 ] ]
J J
( (
R R e e s s i i s s t t a a n n c c e e , ,
o o
C C / / W W ) ) R R θ θ
J
J J u u n n c c t t i i o o n n
T T h h e e r r m m a a l l
t t o o C C a a s s e e
= 25ºC
6
6
6
J J C C

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