CC0805KKX7RABB103 Yageo, CC0805KKX7RABB103 Datasheet - Page 20

• Manufacturer Part Number: CC0805KKX7RABB103
• Description: Family: C2 Type: CC Size: 0805 Tol: K Packing: K Material: X7R Volt: A Cap: 103 Actual Cap:10000
• Manufacturer: Yageo

Mar 25, 2010 V.3
TEST
Adhesion
Bond
strength of
plating on
end face
Resistance to
soldering
heat
Solderability
Surface-Mount Ceramic Multilayer Capacitors
TEST METHOD
IEC 60384-
21/22
4.7
4.8
4.9
4.10
PROCEDURE
A force applied for 10 seconds to the line joining
the terminations and in a plane parallel to the
substrate
Mounting in accordance with IEC 60384-22
paragraph 4.3
Conditions: bending 1 mm at a rate of 1 mm/s,
radius jig 340 mm
Precondition: 150 +0/–10 °C for 1 hour, then
keep for 24 ±1 hours at room temperature
Preheating: for size ≤ 1206: 120 °C to 150 °C for
1 minute
Preheating: for size >1206: 100 °C to 120 °C for
1 minute and 170 °C to 200 °C for 1 minute
Solder bath temperature: 260 ±5 °C
Dipping time: 10 ±0.5 seconds
Recovery time: 24 ±2 hours
Preheated the temperature of 80 °C to 140 °C
and maintained for 30 seconds to 60 seconds.
Test conditions for lead containing solder alloy
Temperature: 235 ±5 °C
Dipping time: 2 ±0.2 seconds
Depth of immersion: 10 mm
Alloy Composition: 60/40 Sn/Pb
Number of immersions: 1
Test conditions for leadfree containing solder alloy
Temperature: 245 ±5 °C
Dipping time: 3 ±0.3 seconds
Depth of immersion: 10 mm
Alloy Composition: SAC305
Number of immersions: 1
Mid-voltage
REQUIREMENTS
Force
size ≥ 0603: 5N
No visible damage
∆C/C
Class 1:
NP0: within ±1% or 0.5 pF, whichever is greater
Class2:
X7R: ±10%
Dissolution of the end face plating shall not
exceed 25% of the length of the edge
concerned
∆C/C
Class 1:
NP0: within ±0.5% or 0.5 pF, whichever is greater
Class2:
X7R: ±10%
D.F. within initial specified value
R
The solder should cover over 95% of the critical
area of each termination
ins
within initial specified value
NP0
/
X7R
100 V to 630 V
Product specification
www.yageo.com
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