GP2W0110YPSF Sharp Microelectronics, GP2W0110YPSF Datasheet - Page 7

• Manufacturer Part Number: GP2W0110YPSF
• Description: Fiber Optic Transmitters, Receivers, Transceivers GP2W0110YPSF Side View T&R
• Manufacturer: Sharp Microelectronics

Specifications of GP2W0110YPSF

• Product: Transceiver
• Data Rate: 115.2 Kbps
• Wavelength: 870 nm
• Maximum Rise Time: 600 ns, 60 ns
• Maximum Fall Time: 600 ns, 60 ns
• Pulse Width Distortion: 300 us, 6 us
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 25 C
• Idle Current, Typ @ 25° C: 90µA
• Link Range, Low Power: 20cm
• Operating Temperature: -25°C ~ 85°C
• Orientation: Top View
• Shutdown: *
• Size: 7.6mm x 2.65mm x 2mm
• Standards: -
• Supply Voltage: 2 V ~ 3.6 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

10. Mechanical Design Hints
SHARP Electronic Components
Rev. 1.2
ELECTRONIC COMPONENTS
10-1. Recommended Foot Print Recommended Solder Paste screen dimensions
In process section 1, the PCB and SMD
GP2W0110YP0F molded pinout joints are
heated to a temperature of 165
the flux in the solder paste. The temperature
ramp up rate R1 should be within the range of 1
C to 4
must be kept within the temperature range
specified in order to avoid localized temperature
rise in the resin by the infrared lamp.
In process section 2, sufficient time to dry the
solder paste should be provided, a maximum of
120 seconds is recommended for optimum
result. The temperature is recommended to be
stable with little temperature increase,
preferably staying at the level of 165
, March 7, 2002
o
C per second. Package temperature
Heat Up
Solder Paste Dry
Solder Reflow
Cooling
Section
NOTES:
1. Dimensions are in mm.
2. Dimensions are for reference.
3.
0.6
165
o
Temperature
C to activate
200
~165
o
165
C ~ 230
Soldering paste area
o
C.
o
C ~
o
o
C
C
0.475
o
IrDA Low Power Infrared Transceiver
C
o
1.425
Symbol
1.55
2.375
R1
R2
R3
-
3.325
Process section 3 is the section for solder
reflow. In this section, the temperature should
be raised up to the point of 230
at the rate of 1
desired result. The dwell time above 200
must not exceed 60 seconds. Beyond 60
seconds, weak and unreliable connections will
result. The temperature should be then reduced
to at the rate of -1
Please note that deformation of the PCB can
also affect the lead pins of the package, which
may break the gold wire used in the transceiver
module. Full confirmation of the soldering reflow
machine condition is highly recommended for
the optimized result.
Temperature / Time Max.
-1
1
1
o
o
o
GP2W0104YP-5
C ~ 4
C ~ 4
C ~ -4
o
C to 4
o
o
C / sec Max.
C / sec Max.
o
o
C / sec Max.
C to -4
o
C per second (R2) for
o
C per second (R3).
o
C for 5 seconds,
o
7
C