GP1UF311XP0F Sharp Microelectronics, GP1UF311XP0F Datasheet
GP1UF311XP0F
Specifications of GP1UF311XP0F
Related parts for GP1UF311XP0F
GP1UF311XP0F Summary of contents
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GP1UF31xYP0F ■ Features 1. Low power dissipation with no light input (270 µA TYP.) 2. Self-protected against static electricity 3. Four parts, offering a number of center frequencies: Center Bandpass Part Number Frequency (TYP.) GP1UF310YP0F 36 kHz GP1UF311YP0F 38 kHz ...
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External Dimensions 0.1 MAX. 6.8 ±0.1 0.1 MAX. G17 Y01 Detector Center 6-0.2 ±0.1 4-P0.8 NOTES: 1. Units Unspecified tolerence: ±0 Resin burr portions are shown 4. A*: 0.15 mm MAX. Coplanarity ...
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Block Diagram Amp Limiter GP1UF31YP0F-7 ■ Absolute Maximum Ratings Parameter Symbol Supply voltage V CC Operating temperature Topr Storage temperature Tstg Soldering temperature Tsol 1 Non-condensing: humidity kept above dew point Apply heat no more than 10 ...
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Electro-optical Characteristics Parameter Symbol Operating supply voltage V Current dissipation I Output HIGH voltage V Output LOW voltage V Output HIGH pulse width T1 Output LOW pulse width T2 Bandpass Frequency center ƒo Output pullup resistance ...
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Performance Measurements The parameters in the Characteristics tables were gathered using the transmitter jig in Fig. 2, along with the receiver jig in Fig Linear Reception: Distance between transmitter and receiver: 0.2 to 5.0 meters; detector face ...
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Design Considerations Design Guidelines 1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant. 2. Avoid placing mechanical stress upon this part, whether to the case or terminals. Such stresses may crack the molding material, possibly breaking ...
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Fig. 5. Device Connection GND NC NC Vout C GND Vout GP1UF31YP0F-3 ■ Manufacturing Guidelines ● Storage and Handling 1. Moisture-proofing: These parts are shipped in vacuum-sealed packaging to keep them dry and ready for use. ...
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Soldering Instructions 1. Sharp recommends soldering this part no more than twice and at the profile shown in Fig. 6. Reflow should occur within three days, after storing at 10°C to 30°C, and at no more than 70% relative ...
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PCB Footprint Fig. 7 shows the recommended PCB footprint for this device. Fig. 7. Device Footprint Center of Mounting Area 2 0.8 1.1 1.6 0.3 2.4 Avoid circuit runs in this area. GP1UF31YP0F-4 ● Conductive ...
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Soldering Mask Fig. 9 shows the recommended solder mask for this device. Fig. 9. Soldering Mask 2.8 0.8 0.3 1.6 2.4 NOTES: 1. Units Dimensions are shown for reference = Soldering paste area GP1UF31YP0F-6 ● Cleaning Instructions ...
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Tape Specifications Fig. 10 Tape Shape and Dimensions 2.0 ±0.10 4.0 8.0 ±0.10 GP1UF31YP0F-12 Preliminary ±0.10 +0.10 1.5 -0.00 2.04 ±0.10 1.23 1.23 ±0.10 ±0.10 11 GP1UF31xYP0F Series 0.33 ±0.05 2.30 ±0.10 Sheet No.: OP06Y11A March 2009 ...
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Reel Specifications Fig. 11 Reel Shape and Dimensions 2.0 ±0.5 21.0 ±0.8 330.0 ±2.0 GP1UF31YP0F-13 ■ Product Insertion Direction Fig. 12 shows the orientation of the device in the tape. Fig. 12 Product Insertion Label GP1UF31YP0F-14 Preliminary 22.4 ±1.0 ...
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Packing Information Product is sealed in laminated aluminum bags with 2000 pieces per reel, silica gel desiccant, and humidity telltale. The EIAJ C-3 compliant label is filled out and affixed to the bag. Four of these packaged reels of ...
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Presence of ODCs (RoHS Compliance) This product shall not contain the following materials, and they are not used in the production process for this product: • Regulated substances: CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform). Specific brominated flame retardants such ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...