MC306-32.768K-A Epson, MC306-32.768K-A Datasheet
MC306-32.768K-A
Manufacturer Part Number
MC306-32.768K-A
Description
Manufacturer
Epson
Datasheet
1.MC306-32.768K-A.pdf
(1 pages)
Specifications of MC306-32.768K-A
Lead Free Status / RoHS Status
Supplier Unconfirmed
19
Crystal unit
SMALL SMD LOW / MEDIUM-FREQUENCY CRYSTAL UNIT
MC-306
Product number (please refer to page 1)
• High-density mounting-type SMD.
• Photolithography finished allows uniform and stable performance.
• Excellent reliability and environmental capability.
Q1 xMC 3 0 6 x x x x x 0 0
Do not connect #2 and #3 to external device.
Metal may be exposed on the top or bottom of this product. This won't affect any quality, reliability or electrical spec.
Nominal frequency
Temperature
range
Maximum drive level
Frequency tolerance (standard)
Peak temperature (frequency)
Temperature coefficient (frequency)
Load capacitance
Series resistance
Motional capacitance
Shunt capacitance
Insulation resistance
Aging
Shock resistance
External dimensions
pecifications (characteristics)
#4
#1
0.5
E
32.768k
Item
Storage temperature
Operating temperature
8.0 Max.
5.5
571
#3
#2
Symbol
T
S.R.
T
∆f/f
GL
θT
C
R
C
C
IR
fa
STG
OPR
a
f
L
1
1
0
±20 x 10
±3 x 10
50 kΩ Max.
32.768 kHz
0.9 pF Typ.
1.8 fF Typ.
-6
(0.9)
-6
/year Max.
Internal connection
, ±50 x 10
6 pF to ∞ (Standard : 12.5 pF)
#4
#1
-0.04 x 10
-55 °C to +125 °C
-40 °C to +85 °C
±5 x 10
Specifications
500 MΩ Min.
+25 °C ±5 °C
1.9
1.0 µW Max.
-6
-6
20.000 kHz to 165.000 kHz
-6
/ °C
#3
#2
±50 x 10
Max.
(0.9)
±5 x 10
2
55 kΩ to 10 kΩ
2.0 pF to 0.6 pF
Max.
4.0 fF to 0.6 fF
(Unit: mm)
-6
-6
, ±100 x 10
/year Max.
-6
Recommended soldering pattern
Three drops on a hard board from 750 mm or excitation
test with 29400 m/s
1.3
Stored as bare product after unpacking
For details, refer to page 13
Ta=+25 °C ±3 °C, first year
Ta=+25 °C, DL=0.1 µW
2
x 0.3 ms x 1/2 sine wave x 3 directions
4.2
Please specify
Remarks
Actual size
1.3
(Unit: mm)
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