BLM18AG102SN1 Murata, BLM18AG102SN1 Datasheet - Page 184

• Manufacturer Part Number: BLM18AG102SN1
• Manufacturer: Murata

Specifications of BLM18AG102SN1

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -55C to 125C
• Current Rating (max): 0.4A
• Product Height (mm): 0.8mm
• Product Depth (mm): 0.8mm
• Product Length (mm): 1.6mm
• Lead Free Status / RoHS Status: Compliant

6
!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
182
EMIFILr (Soldering and Mounting)
NFM
NFR
NFL
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Series
NFM18PS
NFM3DC/3DP
NFM41C/41P
oUse Sn/Pb=60/40 or Sn-3.0Ag-0.5Cu solder for
oCoat with solder paste to the following thickness:
NFM18C/18PC
NFL18ST
pattern printing. Use of Sn-Zn based solder will
deteriorate performance of products. If using NFM
series with Sn-Zn based solder, please contact
Murata in advance.
100-150 m: NFM18/21/3D/31P, NFR, NFL
150-200 m: NFM55P
100-200 m: NFM41
1.0
2.2
0.4
0.05
1.0
2.5
3.9
1.5
3.5
5.5
0.8
1.2
2.0
NFL18SP
Solder Paste Printing
1.0
2.0
0.4
NFM31P
NFM55P
1.5
4.7
6.7
4.4
1.0
2.5
NFM21C/21P
NFR21G/NFL21S
1.4
0.6
2.6
Apply 0.1mg for NFM41C/41P and 0.06mg
for NFM3D/NFM31PC of bonding agent at
each chip. Do not cover electrodes.
Bonding agent
Adhesive Application
Continued on the following page.
Coating position of
bonding agent
(in mm)
C31E.pdf
08.9.1