BNX025H01B Murata, BNX025H01B Datasheet - Page 69

• Manufacturer Part Number: BNX025H01B
• Manufacturer: Murata

Specifications of BNX025H01B

• Lead Free Status / RoHS Status: Supplier Unconfirmed

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Standard Land Pattern Dimensions
BLM18A_WH series
is designed for
conductive glue
mounting method,
not for normal
soldering method.
Please contact us
for applicable
mounting method for
BLM18A_WH series.
2
BLM15
BLM18
BLM21
BLM31
BLM41
NFE61H
NFM21H
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
BLM Series
Chip mounting side
oReflow and Flow
o Reflow Soldering
o Reflow Soldering
NFM21H
BLM15
BLM18
(Except 18PG)
BLM21
(Except 21PG)
BLM31
(Except 31PG)
1
Part Number
Chip mounting side
BLM15 is specially adapted for reflow soldering.
Type
2.0
4.8
8.8
1
2
Small diameter thru hole ø0.4
(Except BLMppP series)
a
b
0.6
Soldering
Small diameter thru hole ø0.4
a
Reflow
Reflow
Reflow
Reflow
Flow/
Flow/
Flow
a
b
c
1.4
b
2.6
c
Size (mm)
0.4
0.7
1.2
2.0
a
0.6
d
1.2-1.4
2.2-2.6
1.8-2.0
3.0-4.0
4.2-5.2
0.8
e
b
1.9
f
0.5
0.7
1.0
1.2
c
Chip EMIFILr (Soldering and Mounting)
2.3
g
• Do not apply narrower pattern than listed above to BLMppP.
BLMppP
BLM18PG
BLM21PG
BLM31PG
BLM41PG
Narrow pattern can cause excessive heat or open circuit.
Chip mounting side
The chip EMI filter suppresses noise by conducting the high-
frequency noise to ground. Therefore, to get enough noise
reduction, feed through holes which are connected to ground-
plane should be arranged according to the figure to reinforce
the ground pattern.
• NFM21 is specially adapted for reflow soldering.
o Flow Soldering (Except NFE61HT332)
Type
Small diameter thru hole ø0.4
1.5
3.8
4.8
9.0
Current
0.5-1.5
1.5/2
Rated
1.5
1-2
(A)
2
3
2
3
6
3
6
3
6
a
b
Soldering
Reflow
Flow/
0.7
1.2
2.0
3.0
a
Continued on the following page.
2.2-2.6
Reflow
1.8-2.0
3.0-4.0
4.2-5.2
5.5-6.5
Flow
b
0.7
1.0
1.2
Land Pattern
+ Solder Resist
Land Pattern
Solder Resist
c
Land pad thickness
18 m 35 m 70 m
0.7
1.2
2.4
1.0
1.2
2.4
6.4
1.2
2.4
6.4
1.2
2.4
6.4
and dimension d
0.7
0.7
1.2
1.0
1.0
1.2
3.3
1.2
1.2
3.3
1.2
1.2
3.3
1.65
1.65
1.65
0.7
0.7
0.7
1.0
1.0
1.0
1.2
1.2
1.2
1.2
(in mm)
C50E.pdf
67
08.8.28
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