2NBS14-TG2-473LF Bourns Inc., 2NBS14-TG2-473LF Datasheet

2NBS14-TG2-473LF

Manufacturer Part Number

2NBS14-TG2-473LF

Description

Manufacturer

Bourns Inc.

Type

Networkr

Datasheet

1.2NBS14-TG2-473LF.pdf (4 pages)

Specifications of 2NBS14-TG2-473LF

Technology

Thin Film

Resistance

47kohm

Power Rating

Power Rating Per Resistor

1/10W

Number Of Resistors

Tolerance (+ Or -)

Circuit Designator

BUS

Package / Case

SOIC

Mounting Style

Surface Mount

Temperature Coefficient

±100

Military Standard

Not Required

Operating Temp Range

-55C to 125C

No. Of Terminals

Case Style

Molded

Failure Rate

Not Required

Termination Style

Gull Wing

Terminal Pitch

1.27

Product Length (mm)

8.74mm

Product Depth (mm)

5.8mm

Product Height (mm)

1.75mm

Lead Free Status / RoHS Status

Compliant

Current page: 1 of 4
Download datasheet (343Kb)

Bussed Resistor networks are typically used in DC pull-up

and pull-down applications where system data or control lines

must be tied to a fixed potential. Fabricated with a Tantalum

Nitride and Nickel Chromium on Silicon process, these

resistors feature excellent stability, TCR and tracking

performance. Bussed Resistor Networks are available in a

range of miniature package types conforming to JEDEC

standards.

*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

General Information

Electrical Characteristics

Resistance Range

Tolerance:

TCR:

Operating Voltage

Environmental Characteristics

ESD

Operating Temperature

Storage Temperature

Power Rating per Resistor @ 70 °C

Power Rating per Package @ 70 °C:

Electrical & Environmental Characteristics

Absolute

Ratio

Absolute

Tracking

QSOP:

NBSOIC: 8 Pin

16 Pin

20, 24 Pin

28 Pin

14, 16 Pin

Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors

Features

■

Lead free

RoHS compliant*

Multiple resistors tied to a common node

Stable thin-film-on-silicon technology

Ultra-miniature packages to JEDEC

standards

Symbol

T stg

T J

Minimum

Package Schematic

±0.5 %

±0.1 %

100

2 K

-55

-65

Nominal

100

Applications

■

Bus termination

Pull-up/pull-down

Ideal for space-constrained applications

Models 2QSP-XX2 and 2NBS-XX2

are obsolete and not recommended

for new designs.

Maximum

100 K

±5 %

±2 %

+125

+150

0.75

1.00

1.12

0.60

1.00

150

0.1

ppm/°C

Unit

Watt

°C

Ω

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2NBS14-TG2-473LF Summary of contents

Page 1

... Customers should verify actual device performance in their specific applications. Features ■ Lead free RoHS compliant* ■ ■ Multiple resistors tied to a common node ■ Stable thin-film-on-silicon technology ■ Ultra-miniature packages to JEDEC standards Thin Film on Silicon 2QSP / 2NBS-XX2 Bussed Resistors Package Schematic Symbol Minimum R 100 ±0.5 % ±0 ...

Page 2

... Model A 2NBS08 4.80 - 4.98 (.189 - .196) 2NBS14 8.56 - 8.74 (.337 - .344) 2NBS16 9.80 - 9.98 (.386 - .393) Governing dimensions are in mm. Dimensions in parentheses are in inches and are approximate. JEDEC Reference Number MS-012. Specifications are subject to change without notice. ...

Page 3

... Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. Narrow-Body SOIC Package Power Temperature Derating Curve 125 150 ° Standard Resistance Values 1.0 2NBS14, 2NBS16 .8 .6 2NBS08 . 100 125 150 AMBIENT TEMPERATURE ( C ) ° Resistance Resistance (ohms) ...

Page 4

... Thin Film on Silicon 2QSP / 2NBS -XX2 Bussed Resistors Dispensing For large quantities, the product will be dispensed in Tape and Reel (see diagram below Package A 0 QSOP 16 Pin 6.4 (0.252) 20, 24 Pin 6.5 (0.256) 28 Pin 6.5 (0.256) NBSOIC 8 Pin 6.4 (0.252) 14 Pin 6.5 (0.256) 16 Pin 6 ...

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