DIN-064CPB-RR1-MH 3M Interconnect Solutions, DIN-064CPB-RR1-MH Datasheet
DIN-064CPB-RR1-MH
Specifications of DIN-064CPB-RR1-MH
Related parts for DIN-064CPB-RR1-MH
DIN-064CPB-RR1-MH Summary of contents
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... Interconnect Solutions http://www.3M.com/interconnects/ • Multi-pin count socket for VME, VXI and Multibus II daughter cards • Early mate late break (EMLB) grounding contacts for hot swapping • Expanded pin counts • Optional retention clips • Mates with C-form and R-form sockets • ...
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... C = Rows A, B, & C Filled D = Rows A & B Filled Row only 3M Interconnect Solutions http://www.3M.com/interconnects "X" "X " . . LIP 2" DIN - XXX XXX - XXXX Plating and Insulator Color Options: See Table 3 Termination Options: See Table 2 For technical, sales or ordering information call DIN 41612 Series . 2 1. ...
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... Min. Ni all over 0.25 µm [10 µ"] Min. Au Contact Area 5.08 µm [200 µ"] Min. Reflowed Matte Whisker (RIA E1 & C1 apply) Mitigating Sn Term. Area 1.27 µm [50 µ"] Min. Ni all over DIN 41612 Series D E 1.900 [48.26] 1.500 [38.10] 1.900 [48.26] 1 ...
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... HOLE PLATING TABLE For TG and TR (Solder Tail Leads) OSP ENTEK Electrolitic Au Immersion Ag Thickness µin (µm) Thickness µin (µm) HOLE PLATING TABLE For MH, HS and KT (Solder Tail Leads) OSP ENTEK Electrolitic Au Immersion Ag Thickness µin (µm) Thickness µin (µm) DIN 41612 Series .209 5. .110 ±.004 O 2.79 ±0.10 DRILLED HOLE ...
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Regulatory Information Appendix 3M Electronic Solutions Division/Interconnect EUROPE Appendix E1: European Union RoHS Directive 2002/95/EC, Restriction of the Use of Certain Hazardous Substances in Electrical & Electronic Equipment, as amended by EU Commission Decision 2005/618/EC. This product is RoHS Compliant ...
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... The numerical reference in the symbol above should not be construed as a representation regarding the product’s life or an extension of a product warranty. The product warranty is stated below. In the event any product is proven not to conform with 3M’ ...