3-530655-3 TE Connectivity, 3-530655-3 Datasheet - Page 64
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3-530655-3
Manufacturer Part Number
3-530655-3
Description
Manufacturer
TE Connectivity
Type
Card Edger
Datasheet
1.3-530655-3.pdf
(96 pages)
Specifications of 3-530655-3
Number Of Contacts
86POS
Number Of Contact Rows
2
Body Orientation
Straight
Contact Plating
Gold Over Nickel
Contact Material
Phosphor Bronze
Termination Method
Solder
Mounting Style
Through Hole
Product Height (mm)
11.68mm
Pitch (mm)
3.96mm
Housing Material
Polyester
Housing Color
Green
Number Of Dual Positions
43
Post Type
Flow Solder Post
Mounting Ears
With
Mounting Ear Style
Without Threaded Inserts
Termination Post Length (mm [in])
3.81 [0.150]
Centerline (mm [in])
3.96 [0.156]
Row-to-row Spacing (mm [in])
5.08 [0.200]
Post Plating
Bright Tin (100)
Contact Base Material
Phosphor Bronze
Contact Plating, Mating Area, Material
Gold (30)
Underplate Material
Nickel
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Wave solder capable to 240°C
Lead Free Status / RoHS Status
Not Compliant
64
64
Catalog 1654080
Issued 7-03
www.tycoelectronics.com
Product Facts
*Consult Tyco Electronics engi-
neering when paralleling con-
tacts for power applications.
Wide variety of sizes avail-
able from 3 dual positions
and up—no initial tooling
investment required for new
versions
Connectors can be selec-
tively loaded with contacts
in custom patterns
Connectors tooled on all
standard centerlines—
.100 [2.54], .125 [3.18],
.150 [3.81], .156 [3.96],
and .200 [5.08]
Note: .200 [5.08] centerline capabili-
ties provided by loading every-other
dual position of .100 [2.54] centerline
housings.
Closed card entry protects
contacts and daughter
board pads
Adapts to a wide range of
mother board thicknesses
to .104 [2.64] maximum
Phosphor bronze contacts
selectively plated for top
performance and maximum
economy
Protective channel helps
prevent overstress of
contacts
Daughter board keying
available in intercontact or
on-contact styles
Recognized under the
Component Program
of Underwriters
Laboratories Inc.,
File No. E28476
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Card Edge Connectors
(Solder Type, Board-to-Board)
The AMP Twin Leaf
Connector is a highly
reliable, low-cost mother/
daughter board connector
designed for solid-state
circuitry. The one-piece,
multi-contact connector
requires no front-end tooling.
This versatile connector for
double-sided printed circuit
boards uses preloaded
contacts and selective plat-
ing to give lowest applied
cost. Critical contact areas
are gold-over-nickel plated
to provide positive electrical
connection between con-
tacts and daughter board
pads. Contact posts are tin
plated for efficient dip
soldering to mother boards
up to .104 [2.64] thick.
The Twin Leaf Connector
delivers high reliability
because the contacts
possess superior tolerance
of environmental stresses
including shock, vibration
and variations of tempera-
ture and humidity. Other
characteristics such as high
insulation resistance, low
Twin Leaf Mother Board Connectors
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
termination resistance, long
life and moderate contact
separation force meet
industry requirements for
reliability. Connectors are
tooled in sizes from 3
through 80 dual-contact
positions with contacts on
.100 [2.54], .125 [3.18],
.150 [3.81], .156 [3.96]
or .200 [5.08] centers.
Other sizes and custom-
loaded contact patterns
are available on request.
The connector housing,
made of glass-filled poly-
ester with a UL 94V-0
rating, features a standoff
which facilitates the use of a
probe for electrical continuity
checks without risk of dam-
age to the contacts. A
closed card-entry design of
the housing protects the
contacts and daughter
board pads. Housings
accept daughter boards
ranging from .055 [1.40] to
.070 [1.78] in thickness.
Intercontact and on-contact
keys are available for
polarization of the housings.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-5-729-0425
Card guides or end caps
make alignment of daughter
board pads with Twin Leaf
Connector contacts quick
and easy.
Performance Specifications
Contact Rating*:
3 amperes continuous
Temperature Rating:
–55°C to +105°C
Insulation Resistance:
5,000 megohms
Dielectric Withstanding Voltage:
Sea Level
50,000 ft
15 240 m
70,000 ft
21 336 m
Termination Resistance:
10 milliohms, max.
Durability: Tested to 100 cycles
(engage/withdraw)
Contact Plating: .000015 [0.00038]
selective gold plating on contact area;
bright tin on solder tine
Altitude
South America: 55-11-3611-1514
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-141-810-8967
.100 [2.54]
Test Voltage (AC, RMS)
1,000
400
280
Contact Spacing
.150 [3.81]
1,500
600
400