BLM41PG102SH1L Murata, BLM41PG102SH1L Datasheet - Page 189

• Manufacturer Part Number: BLM41PG102SH1L
• Manufacturer: Murata

Specifications of BLM41PG102SH1L

• Mounting Style: Surface Mount
• Termination: Flat Style
• Operating Temp Range: -55C to 125C
• Product Height (mm): 1.6mm
• Product Depth (mm): 1.6mm
• Product Length (mm): 4.5mm
• Lead Free Status / RoHS Status: Compliant

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
4. Cleaning
(1) Cleaning Temperature: 60 C max. (40 C max. for
(2) Ultrasonic
(3) Cleaning agent
5. Mounting of BLM15A_AN Series
(1) Die bonding mounting
(a) Dimension of standard metal mask
Following conditions should be observed when cleaning
chip EMI filter.
alcohol type cleaner)
Output: 20W/liter max.
Duration: 5 minutes max.
Frequency: 28 to 40kHz
The following list of cleaning agents have been tested on
the individual components. Evaluation of final assembly
should be completed prior to production.
BLM15A_AN is series for wire bonding mounting.
Continued from the preceding page.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
0.7
Chip Ferrite Bead
Metal thickness: 50 m
(in mm)
(4) Ensure that flux residue is completely removed.
(5) Some products may become slightly whitened.
(b) Die bonding agent
o Use adhesive for die bonding for which the curing
(c) Notice
o Use a flat surface of substrate for bonding mounting.
o Adhesive for die bonding may affect the mounting
Do not clean DLW21S/31S/5AH/5BS/5BT/BNX022/023
series.
Before cleaning, please contact Murata engineering.
(a) Alcohol cleaning agent
(b) Aqueous cleaning agent
Component should be thoroughly dried after aqueous
agent has been removed with deionized water.
However, product performance or usage is not affected.
For additional cleaning methods, please contact Murata
engineering.
temperature is 200 C or less.
Slant mounting of product may affect the wire bonding.
reliability in wire bonding.
Make sure of the mounting reliability with the adhesive to
be used in advance.
Isopropyl alcohol (IPA)
Pine Alpha ST-100S
EMIFILr (Soldering and Mounting)
187
C31E.pdf
08.9.1
6