SI3210MDC1-EVB Silicon Laboratories Inc, SI3210MDC1-EVB Datasheet - Page 134
SI3210MDC1-EVB
Manufacturer Part Number
SI3210MDC1-EVB
Description
MCU, MPU & DSP Development Tools Si3210M Daughter Crd W/ SI3201 INTERFACE
Manufacturer
Silicon Laboratories Inc
Datasheet
1.SI3210MPPQX-EVB.pdf
(146 pages)
Specifications of SI3210MDC1-EVB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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Si3210/Si3211
134
Dimension
Notes:
General
Solder Mask Design
Stencil Design
Card Assembly
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used
2. The stencil thickness should be 0.125mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads
4. A 3x5 array of 0.90mm square openings on 1.10mm pitch should be used for the center
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPEC J-STD-020C specification for
C1
C2
X1
X2
Y1
Y2
mask and the metal pad is to be 60m minimum, all the way around the pad.
to assure good solder paste release.
ground pad.
Small Body Components.
E
Table 49. QFN-38 PCB Land Pattern Dimensions
Pad column spacing
Thermal pad length
Thermal pad width
Pad row spacing
Pin pad width
Pin pad width
Pad pitch
Feature
Rev. 1.5
Min.
4.70
6.70
0.20
3.20
0.80
5.20
0.50 BSC
Max.
4.80
6.80
3.30
5.30
0.30
0.90
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