This notice is to inform you of a change that will be made to certain ADI products (see Material Report). Any issues with this PCN or requirements to
qualify the change (additional data or samples) must be sent to ADI within 30 days of publication date. ADI contact information is listed below.
PCN Title:
Publication Date:
Samples Available Date:
Effectivity Date:
Revision Description:
Description Of Change
Reason For Change
Impact of the change (positive or negative) on fit, form, function & reliability
Product Identification (this section will describe how to identify the changed material)
Summary of Supporting Information
Initial Release
* The Thin Film Mask was changed to increase a single passive resistor size on the setup biasing structure.
* The following datasheet electrical parameters were updated: VOH / VOL / IVR / CMRR / AVO. Attachment #2 summarizes these changes.
* Polyimide was added for die stress reduction, in accordance to Qual Plan 6896, and PCN 07_0024.
* The Molding Compound and Die Attach for the MSOP was transitioned from an obsolete LSA material set to ADI's standard platform of 6600H and 84-1, in
accordance to PCN 07_0024.
The Thin Film mask change improves the performance of the supply current at elevated temperatures. Only a single resistor was changed in the bias setup
circuitry. This change was already implemented on the AD8676, the dual version.
The Datasheet changes properly represent the parts performance as currently manufactured. These corrections and additions bring the AD8675 in-line AD8676
changes that have occurred in PCN 08-0036. Datasheet graphs were also updated to reflect the correct performance.
Polyimide is a stress relief agent which improves the device performance from external stress points. Stress relief is applied to all AD8675 packages.
The MSOP molding compound expired as noted in PCN 07_0024. The conversion to 6600H and 84-1 BOM improves the product manufacturability.
This is positive change to the manufacturability of the product. These corrections properly reflect what can be expected from the product.
Material with date code 0940 or later will be affected.
The changes will be reflected in Rev B of the AD8675 datasheet. See attached Reliability Report - RQR05240 - Attachment #1.
Supporting Documents
Attachment 1:
ADI_PCN_09_0243_Rev_-_RQR05240.pdf
Attachment 2:
ADI_PCN_09_0243_Rev_-_AD8675 Table Changes 11-16-09.pdf
For questions on this PCN, send email to the regional contacts below or contact your local ADI sales representative
Product/Process Change Notice - PCN 09_0243 Rev. -
Analog Devices, Inc. Three Technology Way Norwood, Massachusetts 02062-9106
AD8675 Product Revision
21-Dec-2009
06-Nov-2009
21-Mar-2010 (the earliest date that a customer could expect to receive changed material)
Analog Devices, Inc. PCN 09_0243_Rev_- Page 1 of 4Author=Analog Devices, Inc.