AD9520-3BCPZ Analog Devices Inc, AD9520-3BCPZ Datasheet - Page 61

12/24 Channel Clock Gen 2,0GH

AD9520-3BCPZ

Manufacturer Part Number
AD9520-3BCPZ
Description
12/24 Channel Clock Gen 2,0GH
Manufacturer
Analog Devices Inc
Type
Clock Generator, Fanout Distributionr
Datasheet

Specifications of AD9520-3BCPZ

Design Resources
Synchronizing Multiple AD9910 1 GSPS Direct Digital Synthesizers (CN0121) Phase Coherent FSK Modulator (CN0186)
Pll
Yes
Input
CMOS, LVDS, LVPECL
Output
CMOS, LVPECL
Number Of Circuits
1
Ratio - Input:output
2:12, 2:24
Differential - Input:output
Yes/Yes
Frequency - Max
2.25GHz
Divider/multiplier
Yes/No
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
64-LFCSP
Frequency-max
2.25GHz
Function
Clock Generator
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Package Type
LFCSP EP
Pin Count
64
Mounting
Surface Mount
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
THERMAL PERFORMANCE
Table 48. Thermal Parameters for 64-Lead LFCSP
Symbol
θ
θ
θ
Ψ
θ
Ψ
The AD9520 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation (see the total power dissipation in
Table 18.)
JA
JMA
JMA
JC
J
CASE
JB
JT
JT
is the junction temperature (°C).
is the value from Table 48.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, 0.0 m/sec airflow per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-Std 883, Method 1012.1
Junction-to-top-of-package characterization parameter, 0 m/sec airflow per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
Rev. 0 | Page 61 of 84
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
JA
A
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the equation
JA
can be used for a first-order
AD9520-3
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1

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