ADG1433YRUZ-REEL Analog Devices Inc, ADG1433YRUZ-REEL Datasheet - Page 17

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ADG1433YRUZ-REEL

Manufacturer Part Number
ADG1433YRUZ-REEL
Description
IC,ANALOG SWITCH,TRIPLE,SPDT,CMOS,TSSOP,16PIN,PLASTIC
Manufacturer
Analog Devices Inc
Series
iCMOS®r
Datasheet

Specifications of ADG1433YRUZ-REEL

Function
Switch
Circuit
3 x SPDT
On-state Resistance
4.7 Ohm
Voltage Supply Source
Dual, Single, Dual Supply
Voltage - Supply, Single/dual (±)
±5V, 12V, ±15V
Current - Supply
1µA
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
16-TSSOP (0.173", 4.40mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
ORDERING GUIDE
Model
ADG1433YRUZ
ADG1433YRUZ-REEL
ADG1433YRUZ-REEL7
ADG1433YCPZ-REEL
ADG1433YCPZ-REEL7
ADG1434YRUZ
ADG1434YRUZ-REEL
ADG1434YRUZ-REEL7
ADG1434YCPZ-REEL
ADG1434YCPZ-REEL7
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
1
1
1
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
COPLANARITY
12° MAX
0.15
0.05
PIN 1
Figure 39. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
Figure 38. 20-Lead Thin Shrink Small Outline Package [TSSOP]
0.10
TOP VIEW
BSC SQ
4.00
20
0.80 MAX
0.65 TYP
1
BSC
0.30
0.23
0.18
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
0.65
0.30
0.19
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Description
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Thin Shrink Small Outline Package [TSSOP]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
6.60
6.50
6.40
Dimensions shown in millimeters
Dimensions shown in millimeters
1.20 MAX
BSC SQ
3.75
0.20 REF
Rev. C | Page 17 of 20
0.05 MAX
0.02 NOM
11
10
SEATING
PLANE
COPLANARITY
(CP-20-4)
0.60 MAX
(RU-20)
0.08
4.50
4.40
4.30
BSC
0.50
0.40
0.30
0.50
0.20
0.09
6.40 BSC
0.60 MAX
15
11
16
10
(BOTTOM VIEW)
EXPOSED
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PAD
20
6
1
5
2.65
2.50 SQ
2.35
0.25 MIN
0.75
0.60
0.45
ADG1433/ADG1434
EN Pin
Yes
Yes
Yes
Yes
Yes
Yes
Yes
No
No
No
Package Option
RU-16
RU-16
RU-16
CP-16-13
CP-16-13
RU-20
RU-20
RU-20
CP-20-4
CP-20-4

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