AM29F040B-120JF Spansion Inc., AM29F040B-120JF Datasheet - Page 5

• Manufacturer Part Number: AM29F040B-120JF
• Description: Flash Memory IC
• Manufacturer: Spansion Inc.

Specifications of AM29F040B-120JF

• Memory Size: 4Mbit
• Memory Configuration: 512K X 8
• Ic Interface Type: Parallel
• Access Time: 120ns
• Memory Case Style: PLCC
• No. Of Pins: 32
• Operating Temperature Range: -40°C To +85°C
• Termination Type: SMD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . 5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 6
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 7
Command Definitions . . . . . . . . . . . . . . . . . . . . . 10
Write Operation Status . . . . . . . . . . . . . . . . . . . . 14
November 1, 2006 21445E5
Requirements for Reading Array Data ..................................... 7
Writing Commands/Command Sequences .............................. 7
Program and Erase Operation Status ...................................... 7
Standby Mode .......................................................................... 7
Output Disable Mode................................................................ 8
Autoselect Mode....................................................................... 9
Sector Protection/Unprotection................................................. 9
Hardware Data Protection ........................................................ 9
Reading Array Data ................................................................ 10
Reset Command..................................................................... 10
Autoselect Command Sequence ............................................ 10
Byte Program Command Sequence....................................... 10
Chip Erase Command Sequence ........................................... 11
Sector Erase Command Sequence ........................................ 11
Erase Suspend/Erase Resume Commands........................... 12
Command Definitions ............................................................. 13
DQ7: Data# Polling................................................................. 14
DQ6: Toggle Bit I .................................................................... 15
DQ2: Toggle Bit II ................................................................... 15
Reading Toggle Bits DQ6/DQ2 .............................................. 15
Table 1. Am29F040B Device Bus Operations ...................................7
Table 2. Sector Addresses Table ......................................................8
Table 3. Am29F040B Autoselect Codes (High Voltage Method) .......9
Low V
Write Pulse “Glitch” Protection.......................................................... 9
Logical Inhibit .................................................................................... 9
Power-Up Write Inhibit ...................................................................... 9
Table 4. Am29F040B Command Definitions....................................13
Figure 1. Program Operation ......................................................... 11
Figure 2. Erase Operation.............................................................. 12
Figure 3. Data# Polling Algorithm .................................................. 14
CC
Write Inhibit ........................................................................ 9
D A T A
Am29F040B
S H E E T
Absolute Maximum Ratings. . . . . . . . . . . . . . . . . 18
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . . 18
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 19
Test Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Key to Switching Waveforms. . . . . . . . . . . . . . . . 20
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 21
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 26
Erase and Programming Performance . . . . . . . . 28
Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 28
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . 28
PLCC and PDIP Pin Capacitance. . . . . . . . . . . . . 29
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 30
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 33
DQ5: Exceeded Timing Limits ................................................ 15
DQ3: Sector Erase Timer ....................................................... 16
TTL/NMOS Compatible .......................................................... 19
CMOS Compatible.................................................................. 19
Read Only Operations ............................................................ 21
Erase and Program Operations.............................................. 22
Erase and Program Operations.............................................. 26
PD 032—32-Pin Plastic DIP ................................................... 30
PL 032—32-Pin Plastic Leaded Chip Carrier ......................... 31
TS 032—32-Pin Standard Thin Small Package...................... 32
Table 5. Write Operation Status...................................................... 17
Table 6. Test Specifications ........................................................... 20
Alternate CE# Controlled Writes .................................................... 26
Figure 4. Toggle Bit Algorithm....................................................... 16
Figure 5. Maximum Negative Overshoot Waveform ..................... 18
Figure 6. Maximum Positive Overshoot Waveform....................... 18
Figure 7. Test Setup..................................................................... 20
Figure 8. Read Operation Timings ................................................ 21
Figure 9. Program Operation Timings........................................... 23
Figure 10. Chip/Sector Erase Operation Timings ......................... 23
Figure 11. Data# Polling Timings (During Embedded Algorithms) 24
Figure 12. Toggle Bit Timings (During Embedded Algorithms)..... 24
Figure 13. DQ2 vs. DQ6................................................................ 25
Figure 14. Alternate CE# Controlled Write Operation Timings ..... 27
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