CY7C1315KV18-250BZC Cypress Semiconductor Corp, CY7C1315KV18-250BZC Datasheet - Page 4

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CY7C1315KV18-250BZC

Manufacturer Part Number
CY7C1315KV18-250BZC
Description
CY7C1315KV18-250BZC
Manufacturer
Cypress Semiconductor Corp
Datasheet

Specifications of CY7C1315KV18-250BZC

Format - Memory
RAM
Memory Type
SRAM - Synchronous, QDR II
Memory Size
18M (512K x 36)
Speed
250MHz
Interface
Parallel
Voltage - Supply
1.7 V ~ 1.9 V
Operating Temperature
0°C ~ 70°C
Package / Case
165-LFBGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
CY7C1315KV18-250BZC
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Part Number:
CY7C1315KV18-250BZC
Manufacturer:
CYPRESS/赛普拉斯
Quantity:
20 000
Part Number:
CY7C1315KV18-250BZCT
Manufacturer:
Cypress Semiconductor Corp
Quantity:
10 000
Contents
Pin Configuration ............................................................. 5
Pin Definitions .................................................................. 7
Functional Overview ........................................................ 9
Application Example ...................................................... 11
Truth Table ...................................................................... 11
Write Cycle Descriptions ............................................... 12
Write Cycle Descriptions ............................................... 12
Write Cycle Descriptions ............................................... 13
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 14
TAP Controller State Diagram ....................................... 16
TAP Controller Block Diagram ...................................... 17
TAP Electrical Characteristics ...................................... 17
Document Number: 001-58904 Rev. *C
165-ball FBGA (13 × 15 × 1.4 mm) Pinout .................. 5
Read Operations ......................................................... 9
Write Operations ......................................................... 9
Byte Write Operations ................................................. 9
Single Clock Mode ...................................................... 9
Concurrent Transactions ........................................... 10
Depth Expansion ....................................................... 10
Programmable Impedance ........................................ 10
Echo Clocks .............................................................. 10
PLL ............................................................................ 10
Disabling the JTAG Feature ...................................... 14
Test Access Port—Test Clock ................................... 14
Test Mode Select (TMS) ........................................... 14
Test Data-In (TDI) ..................................................... 14
Test Data-Out (TDO) ................................................. 14
Performing a TAP Reset ........................................... 14
TAP Registers ........................................................... 14
TAP Instruction Set ................................................... 14
TAP AC Switching Characteristics ............................... 18
TAP Timing and Test Conditions .................................. 18
Identification Register Definitions ................................ 19
Scan Register Sizes ....................................................... 19
Instruction Codes ........................................................... 19
Boundary Scan Order .................................................... 20
Power Up Sequence in QDR II SRAM ........................... 21
Maximum Ratings ........................................................... 22
Operating Range ............................................................. 22
Neutron Soft Error Immunity ......................................... 22
Electrical Characteristics ............................................... 22
Capacitance .................................................................... 25
Thermal Resistance ........................................................ 25
Switching Characteristics .............................................. 26
Switching Waveforms .................................................... 28
Ordering Information ...................................................... 29
Package Diagram ............................................................ 30
Acronyms ....................................................................... 31
Document Conventions ................................................. 31
Document History Page ................................................. 32
Sales, Solutions, and Legal Information ...................... 33
Power Up Sequence ................................................. 21
PLL Constraints ......................................................... 21
DC Electrical Characteristics ..................................... 22
AC Electrical Characteristics ..................................... 24
Ordering Code Definitions ......................................... 29
Units of Measure ....................................................... 31
Worldwide Sales and Design Support ....................... 33
Products .................................................................... 33
PSoC Solutions ......................................................... 33
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