DSPIC33FJ32GP204-H/ML Microchip Technology, DSPIC33FJ32GP204-H/ML Datasheet - Page 62
![16-bit DSC, 44LD,32KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm TUBE](/photos/16/12/161255/qfn28_sml.jpg)
DSPIC33FJ32GP204-H/ML
Manufacturer Part Number
DSPIC33FJ32GP204-H/ML
Description
16-bit DSC, 44LD,32KB Flash,40 MIPS,nanoWatt 44 QFN 8x8x0.9mm TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheet
1.DSPIC33FJ16GP304-IPT.pdf
(284 pages)
Specifications of DSPIC33FJ32GP204-H/ML
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
35
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 13x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 140°C
Package / Case
44-VQFN Exposed Pad
Processor Series
dsPIC33F
Core
dsPIC
Data Bus Width
16 bit
Interface Type
SPI, I2C, UART, JTAG
Number Of Programmable I/os
35
Operating Supply Voltage
3.3 V
Maximum Operating Temperature
+ 140 C
Mounting Style
SMD/SMT
Development Tools By Supplier
MPLAB IDE Software
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 13 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
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- Download datasheet (4Mb)
dsPIC33FJ32GP202/204 and dsPIC33FJ16GP304
EXAMPLE 5-2:
EXAMPLE 5-3:
DS70290G-page 62
; Set up NVMCON for row programming operations
; Set up a pointer to the first program memory location to be written
; program memory selected, and writes enabled
; Perform the TBLWT instructions to write the latches
; 0th_program_word
; 1st_program_word
;
; 63rd_program_word
2nd_program_word
MOV
MOV
MOV
MOV
MOV
MOV
MOV
TBLWTL W2, [W0]
TBLWTH W3, [W0++]
MOV
MOV
TBLWTL W2, [W0]
TBLWTH W3, [W0++]
MOV
MOV
TBLWTL W2, [W0]
TBLWTH W3, [W0++]
•
•
•
MOV
MOV
TBLWTL W2, [W0]
TBLWTH W3, [W0++]
DISI
MOV
MOV
MOV
MOV
BSET
NOP
NOP
#0x4001, W0
W0, NVMCON
#0x0000, W0
W0, TBLPAG
#0x6000, W0
#LOW_WORD_0, W2
#HIGH_BYTE_0, W3
#LOW_WORD_1, W2
#HIGH_BYTE_1, W3
#LOW_WORD_2, W2
#HIGH_BYTE_2, W3
#LOW_WORD_31, W2
#HIGH_BYTE_31, W3
#5
#0x55, W0
W0, NVMKEY
#0xAA, W1
W1, NVMKEY
NVMCON, #WR
LOADING THE WRITE BUFFERS
INITIATING A PROGRAMMING SEQUENCE
;
; Initialize NVMCON
;
; Initialize PM Page Boundary SFR
; An example program memory address
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
;
;
; Write PM low word into program latch
; Write PM high byte into program latch
; Block all interrupts with priority <7
; for next 5 instructions
; Write the 55 key
;
; Write the AA key
; Start the erase sequence
; Insert two NOPs after the
; erase command is asserted
© 2011 Microchip Technology Inc.
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