DSPIC33FJ32MC202-E/MM Microchip Technology, DSPIC33FJ32MC202-E/MM Datasheet - Page 232

• Manufacturer Part Number: DSPIC33FJ32MC202-E/MM
• Description: 16-bit DSC, 32KB Flash,Motor,40 MIPS,nanoWatt 28 QFN-S 6x6mm TUBE
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ32MC202-E/MM

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 21
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 6x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 28-QFN
• Package: 28QFN-S EP
• Device Core: dsPIC
• Family Name: dSPIC33
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 3.3 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 21
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit|6-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
24.1
TABLE 24-1:
TABLE 24-2:
TABLE 24-3:
DS70283H-page 232
Characteristic
Industrial Temperature Devices
Extended Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 44-pin QFN
Package Thermal Resistance, 44-pin TFQP
Package Thermal Resistance, 28-pin SPDIP
Package Thermal Resistance, 28-pin SOIC
Package Thermal Resistance, 28-pin SSOP
Package Thermal Resistance, 28-pin QFN-S
Note 1:
DC5
I/O = Σ ({V
DC Characteristics
P
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
INT
Junction to ambient thermal resistance, Theta-
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
x (I
- V
V
DD
(in Volts)
DD
3.0-3.6V
3.0-3.6V
OH
Characteristic
- Σ I
Range
} x I
Rating
OH
OH
)
) + Σ (V
OL
x I
OL
)
-40°C to +125°C
-40°C to +85°C
Temp Range
(in °C)
JA
(
θ
JA
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
θ
θ
θ
P
T
T
T
T
JA
JA
JA
JA
JA
JA
A
A
D
J
J
Min
Typ
-40
-40
-40
-40
dsPIC33FJ32MC202/204 and
32
45
45
50
71
35
dsPIC33FJ16MC304
(T
P
© 2011 Microchip Technology Inc.
INT
J
- T
Max
Typ
Max MIPS
—
—
—
—
—
—
—
—
—
—
+ P
A
)/θ
40
40
I
/
JA
O
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
+125
+140
+125
Max
Unit
+85
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1
1
1
1