DSPIC33FJ32MC202-E/MM Microchip Technology, DSPIC33FJ32MC202-E/MM Datasheet - Page 298

16-bit DSC, 32KB Flash,Motor,40 MIPS,nanoWatt 28 QFN-S 6x6mm TUBE

DSPIC33FJ32MC202-E/MM

Manufacturer Part Number
DSPIC33FJ32MC202-E/MM
Description
16-bit DSC, 32KB Flash,Motor,40 MIPS,nanoWatt 28 QFN-S 6x6mm TUBE
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr

Specifications of DSPIC33FJ32MC202-E/MM

Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
Number Of I /o
21
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 6x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
28-QFN
Package
28QFN-S EP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Data Bus Width
16 Bit
Number Of Programmable I/os
21
Interface Type
I2C/SPI/UART
On-chip Adc
6-chx10-bit|6-chx12-bit
Number Of Timers
5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ32MC202-E/MM
Quantity:
600
dsPIC33FJ32MC202/204 and dsPIC33FJ16MC304
DS70283H-page 298
44-Lead Plastic Quad Flat, No Lead Package (ML) – 8x8 mm Body [QFN]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated.
3. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A3
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Number of Pins
Pitch
Overall Height
Standoff
Contact Thickness
Overall Width
Exposed Pad Width
Overall Length
Exposed Pad Length
Contact Width
Contact Length
Contact-to-Exposed Pad
TOP VIEW
D
N
A1
Dimension Limits
1
2
E
EXPOSED
A
NOTE 1
Units
A1
A3
E2
D2
N
D
A
E
K
e
b
L
PAD
E2
1
2
0.80
0.00
6.30
6.30
0.25
0.30
0.20
MIN
N
MILLIMETERS
0.65 BSC
0.20 REF
8.00 BSC
8.00 BSC
BOTTOM VIEW
NOM
0.90
0.02
6.45
6.45
0.30
0.40
44
Microchip Technology Drawing C04-103B
D2
© 2011 Microchip Technology Inc.
L
MAX
1.00
0.05
6.80
6.80
0.38
0.50
K
e
b

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