BAV70,215 NXP Semiconductors, BAV70,215 Datasheet - Page 9
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BAV70,215
Manufacturer Part Number
BAV70,215
Description
DIODE SW DBL 100V 215MA HS SOT23
Manufacturer
NXP Semiconductors
Datasheet
1.BAV70235.pdf
(15 pages)
Specifications of BAV70,215
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Voltage - Forward (vf) (max) @ If
1V @ 50mA
Current - Reverse Leakage @ Vr
500nA @ 80V
Current - Average Rectified (io) (per Diode)
215mA (DC)
Voltage - Dc Reverse (vr) (max)
100V
Reverse Recovery Time (trr)
4ns
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Diode Configuration
1 Pair Common Cathode
Mounting Type
Surface Mount
Product
Switching Diodes
Peak Reverse Voltage
100 V
Forward Continuous Current
0.215 A
Max Surge Current
4 A
Configuration
Dual Common Cathode
Recovery Time
4 ns
Forward Voltage Drop
1.25 V
Maximum Reverse Leakage Current
0.5 uA
Operating Temperature Range
+ 150 C
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Mounting Style
SMD/SMT
Rectifier Type
Switching Diode
Peak Rep Rev Volt
100V
Avg. Forward Curr (max)
0.215A
Rev Curr
0.5uA
Peak Non-repetitive Surge Current (max)
4A
Forward Voltage
1.25V
Operating Temp Range
-65C to 150C
Package Type
TO-236AB
Rev Recov Time
4ns
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-1622-2
933184910215
BAV70 T/R
933184910215
BAV70 T/R
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
BAV70,215
Manufacturer:
NXP Semiconductors
Quantity:
20 000
Part Number:
BAV70,215
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
10. Packing information
11. Soldering
BAV70_SER_7
Product data sheet
Table 9.
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
[2]
[3]
Type number Package
BAV70
BAV70M
BAV70S
BAV70T
BAV70W
Fig 12. Reflow soldering footprint BAV70 (SOT23/TO-236AB)
For further information and the availability of packing methods, see
T1: normal taping
T2: reverse taping
3.00
Packing methods
0.85
0.85
SOT23
SOT883
SOT363
SOT416
SOT323
1.30
Rev. 07 — 27 November 2007
2
Description
4 mm pitch, 8 mm tape and reel
2 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel; T1
4 mm pitch, 8 mm tape and reel; T2
4 mm pitch, 8 mm tape and reel
4 mm pitch, 8 mm tape and reel
2.90
2.50
1.00
3.30
3
0.50 (3x)
0.60 (3x)
1
0.60
(3x)
sot023
2.70
Section
High-speed switching diodes
BAV70 series
[1]
Dimensions in mm
14.
[2]
[3]
solder lands
solder resist
solder paste
occupied area
Packing quantity
3000
-215
-
-115
-125
-115
-115
© NXP B.V. 2007. All rights reserved.
10000
-235
-315
-135
-165
-135
-135
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