BAS70-05W,135 NXP Semiconductors, BAS70-05W,135 Datasheet - Page 11
![DIODE SCHOTTKY 70V 70MA SOT323](/photos/5/24/52427/568-umt3_sot-323_sc-70_sot323_sml.jpg)
BAS70-05W,135
Manufacturer Part Number
BAS70-05W,135
Description
DIODE SCHOTTKY 70V 70MA SOT323
Manufacturer
NXP Semiconductors
Datasheet
1.BAS70-04215.pdf
(20 pages)
Specifications of BAS70-05W,135
Package / Case
SC-70-3, SOT-323-3
Voltage - Forward (vf) (max) @ If
1V @ 15mA
Current - Reverse Leakage @ Vr
10µA @ 70V
Current - Average Rectified (io) (per Diode)
70mA (DC)
Voltage - Dc Reverse (vr) (max)
70V
Diode Type
Schottky
Speed
Small Signal =< 200mA (Io), Any Speed
Diode Configuration
1 Pair Common Cathode
Mounting Type
Surface Mount
Product
Schottky Diodes
Peak Reverse Voltage
70 V
Forward Continuous Current
0.07 A
Max Surge Current
0.1 A
Configuration
Dual Common Cathode
Forward Voltage Drop
1 V @ 0.015 A
Maximum Reverse Leakage Current
10 uA
Operating Temperature Range
+ 150 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934034490135
BAS70-05W /T3
BAS70-05W /T3
BAS70-05W /T3
BAS70-05W /T3
NXP Semiconductors
10. Soldering
BAS70_1PS7XSB70_SER_9
Product data sheet
Fig 14. Reflow soldering footprint SOD323 (SC-76)
Fig 15. Wave soldering footprint SOD323 (SC-76)
Fig 16. Reflow soldering footprint SOD523 (SC-79)
Dimensions in mm
Dimensions in mm
Reflow soldering is the only recommended soldering method.
Dimensions in mm
1.65
2.75
0.95
1.20
BAS70 series; 1PS7xSB70 series
Rev. 09 — 13 January 2010
0.50
(2×)
solder lands
solder resist
occupied area
solder paste
preferred transport direction during soldering
3.05
2.80
2.10
1.60
1.20
5.00
4.40
1.40
0.50
msa433
1.80
1.90
0.60
2.15
General-purpose Schottky diodes
msa415
0.30
0.40
0.50
mgs343
0.60
solder lands
solder resist
occupied area
solder paste
solder lands
solder resist
occupied area
© NXP B.V. 2010. All rights reserved.
11 of 20