HFA25TB60 Vishay, HFA25TB60 Datasheet - Page 2

• Manufacturer Part Number: HFA25TB60
• Description: DIODE HEXFRED 600V 25A TO-220AC
• Manufacturer: Vishay
• Series: HEXFRED®r

Specifications of HFA25TB60

• Voltage - Forward (vf) (max) @ If: 1.7V @ 25A
• Voltage - Dc Reverse (vr) (max): 600V
• Current - Average Rectified (io): 25A
• Current - Reverse Leakage @ Vr: 20µA @ 600V
• Diode Type: Standard
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Reverse Recovery Time (trr): 75ns
• Mounting Type: Through Hole
• Package / Case: TO-220-2 Fused Center, TO-220AC
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Capacitance @ Vr, F: -
• Other names: *HFA25TB60; VS-HFA25TB60; VS-HFA25TB60; VSHFA25TB60; VSHFA25TB60

HFA25TB60
Vishay High Power Products
www.vishay.com
2
ELECTRICAL SPECIFICATIONS (T
PARAMETER
Cathode to anode
breakdown voltage
Maximum forward voltage
Maximum reverse
leakage current
Junction capacitance
Series inductance
DYNAMIC RECOVERY CHARACTERISTICS (T
PARAMETER
Reverse recovery time
See fig. 5, 6 and 16
Peak recovery current
See fig. 7 and 8
Reverse recovery charge
See fig. 9 and 10
Peak rate of fall of recovery
current during t
See fig. 11 and 12
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
Lead temperature
Thermal resistance,
junction to case
Thermal resistance,
junction to ambient
Thermal resistance,
case to heatsink
Weight
Mounting torque
Marking device
b
dI
dI
SYMBOL
SYMBOL
SYMBOL
(rec)M
(rec)M
I
I
R
R
R
T
V
V
RRM1
RRM2
Q
Q
I
C
L
t
t
RM
thCS
t
lead
thJC
thJA
rr1
rr2
FM
BR
rr
S
rr1
rr2
T
For technical questions, contact: [e-mail]
/dt1
/dt2
I
I
I
I
V
T
V
Measured lead to lead 5 mm from package body
I
T
T
T
T
T
T
T
T
0.063” from case (1.6 mm) for 10 s
Typical socket mount
Mounting surface, flat, smooth and greased
Case style TO-220AC
R
F
F
F
F
Ultrafast Soft Recovery Diode, 25 A
J
R
R
J
J
J
J
J
J
J
J
= 25 A
= 50 A
= 25 A, T
= 100 µA
= 1.0 A, dI
= 125 °C, V
J
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= 25 °C
= 125 °C
= V
= 200 V
= 25 °C unless otherwise specified)
R
rated
J
TEST CONDITIONS
TEST CONDITIONS
TEST CONDITIONS
= 125 °C
F
/dt = 200 A/µs, V
R
= 0.8 x V
HEXFRED
J
= 25 °C unless otherwise specified)
I
dI
V
R
F
R
F
= 25 A
rated
/dt = 200 A/µs
= 200 V
R
= 30 V
®
See fig. 1
See fig. 2
See fig. 3
MIN.
MIN.
(5.0)
MIN.
600
6.0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
TYP.
TYP.
TYP.
0.07
105
112
420
250
160
600
4.5
8.0
0.5
2.0
1.3
1.5
1.3
1.5
8.0
23
50
55
HFA25TB60
-
-
-
-
-
Document Number: 93085
MAX.
MAX.
MAX.
2000
1200
Revision: 30-Jul-08
(10)
160
375
300
100
1.7
2.0
1.7
1.0
20
75
10
15
80
12
-
-
-
-
-
-
-
-
kgf · cm
(lbf · in)
UNITS
UNITS
UNITS
A/µs
K/W
oz.
µA
pF
nH
nC
ns
°C
V
A
g