SIDC06D120E6 Infineon Technologies, SIDC06D120E6 Datasheet
SIDC06D120E6
Specifications of SIDC06D120E6
Related parts for SIDC06D120E6
SIDC06D120E6 Summary of contents
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... I Die Size 2.45 x 2.45 mm suitable for epoxy and soft solder die bonding electrically conductive glue or solder store in original container, in dry nitrogen, < 6 month at an ambient temperature of 23°C SIDC06D120E6 A C Package Ordering Code Q67050-A4122- sawn on foil A001 2. 3.24 1.73 x 1.73 ...
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... C, unless otherwise specified, tested at component j Conditions I = ° di/dt=130A ° =600V ° di/dt=130A ° = di/dt=130A =5A / di/dt=130A di/dt=130A SIDC06D120E6 Value Unit 1200 tbd 10 -55...+150 C Value Unit min. Typ. max. 27 µA 1200 V 1.9 V Value Unit min. Typ. max. tbd ns 2 0.5 µ C 1.03 tbd tbd 1 ...
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... CHIP DRAWING: Edited by INFINEON Technologies HV3, L 4342P, Edition 1, 8.01.2002 Preliminary SIDC06D120E6 ...
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... Life support devices or systems are intended to be implanted in the human body support and / or maintain and sustain and / or protect human life. If they fail reasonable to assume that the health of the user or other persons may be endangered. Edited by INFINEON Technologies HV3, L 4342P, Edition 1, 8.01.2002 Preliminary SIDC06D120E6 INFINEON TECHNOLOGIES / EUPEC tbd ...